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Copper electrodes, surface

Biggin ME, Gewirth AA. 2001. Infrared studies of benzotriazole on copper electrode surfaces— Role of chloride in promoting reversibility. J Electrochem Soc 148 C339-C347. [Pg.404]

The heterocontacts between layered compound and noble metals - silver and copper - were studied. The standard chemical and electrochemical treatment of silver and copper electrode surfaces [6] was performed before the experiment. To avoid any selective etching and breaking of the surface layer, the SnNb5Sc(, crystals were not chemically treated. [Pg.292]

A very different detection approach was used [40] based on the electro-catalytic oxidation of sugars and amines at a copper electrode surface. The ssDNA and dsDNA were detected in the picomolar concentration range. The electrochemical signal due to dsDNA was higher than due to ssDNA owing to the larger number of easily accessible sugars on the outer perimeter of dsDNA double helix compared to those on a ssDNA of the same size, in contrast to most electrochemical studies based on the electroactivity of the bases. [Pg.97]

Figures 14.22 and 14.23 show the sputter deposition rates of copper from the copper electrode surfaces in argon plasmas at pressures of 30 and 60 mtorr as a function of discharge power. The deposition rate increased with increasing magnetic field strength and discharge power. No appreciable deposition of copper was observed in the argon plasma at a pressure of 30 mtorr for a maximal parallel magnetic component of less than 100 G. Figures 14.22 and 14.23 show the sputter deposition rates of copper from the copper electrode surfaces in argon plasmas at pressures of 30 and 60 mtorr as a function of discharge power. The deposition rate increased with increasing magnetic field strength and discharge power. No appreciable deposition of copper was observed in the argon plasma at a pressure of 30 mtorr for a maximal parallel magnetic component of less than 100 G.
The electrocatalytic oxidation of DNA in the sugar and amine moiety, at a copper electrode surface, was studied by Singhal and Kuhr [81] using a very different detection procedure. [Pg.395]

The electrons travel through the wire to the copper electrode surface where they react with dissolved oxygen gas in the seawater to form hydroxyl ions according to Equation (10)... [Pg.132]

The first reported work using SERS as probe to investigate the adsorption of surfactants at the solid-liquid interface dated from the beginning of the 1980s. In their report. Heard et al. [15] have shown that SERS spectra could be obtained even at submonolayer converge from n-alkylpyridinium bromide adsorbed at Ag colloid surfaces. Dendramis et al. [16] have studied the adsorption of cetyltrimethylammonium bromide (CTAB) on copper electrode surfaces. They were able to determine the CTAB adsorption rates from aqueous solution and observed no changes in the spectra as the concentration was varied... [Pg.188]

Fleischmann, M., Hendra, P.J., McQuillan, A.J. and Paul, R.L. (1975) Raman spectroscopy at the copper electrode surface. Journal of Electroanalytical Chemistry, 66 248. [Pg.8]

Reyter D, Odziemkowski M, Belanger D, Rou L (2007) Electrochemically activated copper electrodes surface characterization, electrochemical behavior, and properties for the electroreduction of nitrate. J Electrochem Soc 154 K36-K44... [Pg.592]

Fig. 3.24 Particle size distribution curves for copper powders obtained by the potentiostatic and galvanostatic (the average current in the potentiostatic regime) electrodepositions on copper electrodes. Surface area of the electrode 0.63 cm (Reprinted from [83] with permission from Springer.)... Fig. 3.24 Particle size distribution curves for copper powders obtained by the potentiostatic and galvanostatic (the average current in the potentiostatic regime) electrodepositions on copper electrodes. Surface area of the electrode 0.63 cm (Reprinted from [83] with permission from Springer.)...
At copper oxide-covered electrodes, another detection mechanism is also possible. At lower potentials and pH (typically at +0.15 V vs. Ag/AgCl (sat d KCl) at pH 6-11), a passivating Cu(Il) oxide or hydroxide film is formed on the copper electrode [117-119]. The dissolution of this film, i.e., the oxidation of metallic copper to Cn(ll), is enhanced in the presence of amino acids and short peptides due to complexation between Cu(II) and the amino acids or peptides [117]. Thus, the current generated originates from oxidation of metalhc copper to Cu(ll)—i.e., the amino acids are not oxidized. The exact composition of the film is not known but it is beheved that a copper(l) oxide or hydroxide layer is located between the copper electrode surface and the Cu(II) oxide or hydroxide layer... [Pg.377]

Glow-Discharge Treatment. HMDS was deposited by plasma polymerization on the PC membranes in a glow-discharge reactor system shown schematically in Figure 2. The reactor was a glass tube (inner diameter 6.4 cm and length 35 cm) with two copper electrodes (surface area of each electrode 140 cm ) mounted on the outside. [Pg.72]


See other pages where Copper electrodes, surface is mentioned: [Pg.173]    [Pg.187]    [Pg.284]    [Pg.423]    [Pg.388]    [Pg.283]    [Pg.794]    [Pg.227]    [Pg.213]    [Pg.197]    [Pg.443]    [Pg.895]    [Pg.15]   


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