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Cooling mechanical analysis

Glass transition temperature (Tg), measured by means of dynamic mechanical analysis (DMA) of E-plastomers has been measured in binary blends of iPP and E-plastomer. These studies indicate some depression in the Tg in the binary, but incompatible, blends compared to the Tg of the corresponding neat E-plastomer. This is attributed to thermally induced internal stress resulting from differential volume contraction of the two phases during cooling from the melt. The temperature dependence of the specific volume of the blend components was determined by PVT measurement of temperatures between 30°C and 270°C and extrapolated to the elastomer Tg at —50°C. [Pg.175]

The dynamic mechanical analysis gives detailed information about the viscoelastic properties of a sample when heated, cooled, or held under isothermal conditions. The three a, (3, and y peaks displayed by the material before melting can be used to evaluate the effects on the PE molecular structure of additives... [Pg.584]

Fig. 3. Dynamic mechanical analysis of poly(amic alkyl ester). Sample heated to 300 °C and held (1 h), cooled and rerun to 450 °C... Fig. 3. Dynamic mechanical analysis of poly(amic alkyl ester). Sample heated to 300 °C and held (1 h), cooled and rerun to 450 °C...
Stopped flow experiment was performed, in which the reactant flow was stopped and replaced with an inert gas flow as the sample is cooled to room temperature, leaving only NNN-TMA ions in the zeolite. Subsequent heating above 200 °C (in a sealed system) resulted in conversion of the NNN-TMA to the other species, showing the NNN-TMA is indeed reactive and part of the reaction mechanism. Analysis of the transient effects of sharp changes in reactant composition by in situ NMR in this way is likely to be very powerful in understanding reaction mechanisms over microporous solid acids. [Pg.338]

Dynamic Mechanical Analysis and Stress Relaxation Behavior. Samples were compression molded into bars of the dimensions 38.xl2.5x0.78 0.007 mm and 65.x9.7xl.7 0.007 mm in a Carver laboratory hot press model C. A TA Instruments 983 DMA, which was operated in the fixed frequency mode, was used to characterize the storage and loss moduli as a function of temperature. Samples were scanned at fi-equencies from 0.05 to 10.0 Hz over a temperature range from -150 C to above the glass transition temperature. The displacement was 0.4 - 0.6 mm. Stress relaxation curves were determined for the same size samples at a constant strain. The sample was displaced for 10.0 minutes and then allowed to recover for 10.0 minutes. The stress data were taken in five degree increments. A microprocessor controlled Liquid Nitrogen Cooling Accessory (LNCA) was used for sub-ambient operations. [Pg.81]

Maximum deformation, parameter in cyclic, thermomechanical tests Free state deformation after cooling Volume fraction Critical volume fraction Volume resistivity Maximum stress 1,4-Butanediol Carbon black Carbon nanotube Dimethylformamide DMTA Dynamic mechanical analysis at varied temperatures DSC Differential scanning calorimetry / Frequency... [Pg.42]

Figure 18.50 Effect of polymer processing on loss modulus by dynamic mechanical analysis. Effect of cooling rate of polyether ether ketone (PEEK) composite loss modulus at Tg. Source TA Instruments, New Castle, DE, USA)... Figure 18.50 Effect of polymer processing on loss modulus by dynamic mechanical analysis. Effect of cooling rate of polyether ether ketone (PEEK) composite loss modulus at Tg. Source TA Instruments, New Castle, DE, USA)...
Thermal analysis (TA) comprises a family of measuring techniques that share a common feature they measure a material s response to being heated or cooled (or, in some cases, held isothermally). The goal is to establish a connection between temperature and specific physical properties of materials. The most popular techniques are those that are the subject of this book, namely differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), thermomechanical analysis (TMA), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and micro/nano-thermal analysis (p/n-TA). [Pg.1]

Theoretical analysis of the simplest model of the interaction of a two-level atom (Fig. 2.4, for the case T2 = I/7) with counterpropagating laser beams has shown that laser cooling makes it possible to reach extremely low temperatures, five to six orders of magnitude lower than room temperatme. It has been shown that in a two-level atom model, the cooling mechanism is based on single-photon absorption (or emission) processes. The minimum temperatme of the atoms is reached at a red detuning equal to the natural half-width of the atomic transition line, that is, / =—7, and is determined by the natural half-width 7 of the atomic transition (Letokhov et al. 1976, 1977) ... [Pg.71]

MalikP l used dynamic mechanical analysis to study the effect of accelerated weathering on the storage and loss moduli of commercially available polyurethane (PU) and silicone construction sealants. Three multicomponent PU and one-component silicone sealants were used in the study. The sealants were exposed to 8 hours of UV exposure at 65°C alternating with 4 hours of condensation at 50°C for 600 and 1000 hours. The moduli G, G tan 5, and the dynamic viscosity (77) were measured in the temperature range of 25° to 125°C. The temperature was increased to 125°C, held for 2 hours and cooled to 25°C. [Pg.590]


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