Composite deposition plating

Composite Plate—an electrodeposit that consists of two or more layers of metals deposited separately. 

Composition. Crystals deposited from ethanol solution as well-formed thin plates. The fatty acid content of the crystals is given in Table I. For all chain lengths the acid content approximates closely that required for 1 to 1 stoichiometry. This is also the case for most of the acid-soaps prepared by the petroleum ether route the low values of titratable acid in some instances are ascribable to the presence of free soap. 

The deposition variables are the process parameters most suited to regulate the particle composite content within the limits set by the particle properties and plating bath composition. Particle bath concentration is the most obvious process variable to control particle codeposition. Within the limits set by the metal plating process and the practical feasibility also current density, bath agitation and temperature can be used to obtain a particular composite. Consequently the deposition process variables are the most extensively investigated parameters in composite plating. The models and mechanisms discussed in Section IV almost exclusively try to explain and model the relation between these process parameters and the particle codeposition rate. 

Composites are deposited using both electroless62-64 and electrolytic plating processes. In the latter case composite deposition occurs in the presence of an applied electrical field, which is characterized by the cathodic potential or current density. The current density is the most extensively investigated process parameter. Roughly two types of current density dependencies can be distinguished. The particle composite content against current density curve either decreases or increases continuously or exhibits one or two... 

The nature of the current density dependence of particle codeposition is the most disputed aspect in the mechanism of composite plating (Section IV). In the simplest case the particle deposition rate is not affected by the current density, either because of particle mass transfer limitations or a current density independent particle-electrode interaction. Since the metal deposition rate increases with current density, this results in a continuously decreasing particle composite content. In other cases the particle-electrode interaction has to be current density dependent. An unambiguous explanation for this dependence has not yet been found, but it is apparent that the metal deposition behavior is involved. 

Combination of metal to be deposited with water repellent powder. In composite plating, the characteristics of particles to be codeposited are the most important. Water repellent fluoroplastic powder represented by Polytetrafluoro-ethylene (PTFE) has various unique and interesting characteristics such as non-adhesiveness, self-lubricity and chemical resistance, as well as water repellency. Incorporation of such powder into the composite plating would give a surface with quite different characteristics from those obtained by conventional surface treatments. Representative water repellent powders used in this study of composite plating are graphite fluoride [(CF) ] and PTFE. 

By making use of the adsorbability of TPs semiconductor particles for photoelectrochemical cells are provided with an adsorbed mixture of dye and TP (e.g., 2) (00JAP(K)228233). Finally, TP carboxylic acids can be contained in compositions for depositing silver layers (plating) (04USP40852). 

Maia, L. Wanga, D. Zhangb, S. Xiea, Y Huangc, C. Zhang, Z. Synthesis and bactericidal ability of Ag/Ti02 composite films deposited on titanium plate, Appl. Sutf. Sci 2010,257, 974-978. 

Stress reflects all the complexity of influences of various factors on formation of metal plates by electrodeposition and has, therefore, been the subject of extensive studies they cover effects of substrate, plating solution composition, pH, deposit thickness, current density, or overpotential, deposition temperature. Detailed reviews are available. " ... 

The co-deposition of microparticles with metal ions in an electrolytic bath under the influence of electric field to form a composite plating coating containing those microparticles. 

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