Chip-on-glass

J.I. Han, S.I. Hong, "Nickel electroless plating process for solder bump chip on glass technology," Jpn. J. Appl. Phys., Vol. 36, 2091-2095 (1997). 

Several approaches using electrically conductive adhesives instead of solder have been explored and are proving successful. Anisotropic adhesives (See Chapter 1), for example, have been used to connect flex circuits and cables from the separate driver circuits to the panel, avoiding the use of solder connections. More importantly, integrated-circuit chips can be bonded directly to the ITO conductor traces on the panel, a technology called chip-on-glass (COG). IC chips can be flip-chip bonded, then underfilled with a stress-free underfill adhesive if necessary. For protection, the chips may then be encapsulated with epoxy (glob-topped). 

Coefficient of thermal expansion (CTE). Amatch to silicon at 35 X 10" /°C is desired for chip-on-glass mounting of peripheral circuits. It also offers decreased thermal shock resistance compared to soda-lime glass. 

Figure 43 Illustration of the main packaging technologies of liquid crystal display devices (a) chip-on-board (b) chip-on-film (c) chip-on-glass, (adapted from Ref. [113], Copyright 1993, Penwell Publishing Company.)...

A process for chip-on-glass bonding of bumped integrated circuits to ITO conductors has been developed by using a two-part isotropic epoxy adhesive loaded with silver flakes [122]. The first observation is that the volume resistivity and contact resistance depend on the type of flakes and the percentage by weight of particles dispersed in the adhesive composition. According to the kind of flakes, the volume resistivity of adhesives loaded with 75-80 wt% silver varies... 

Van Noort, H. M, Kloos, M. J. H., Schafer, FI. E. A. (1994). Anisotropic conductive adhesives for chip on glass and other flip chip applications. Adhesives in Electronics 94, International Conference on Adhesives Joining Technology Electronics Manufacture, VDI/VDE-IT. 

B. ACA-Bumped Flip Chips on Glass Chip Carriers... 

Seiko Epson Corporation developed a new flip chip on glass technology called the MAPLE (Metal-Insulator Metal Active Panel LSI Mount Engineering) method. The MAPLE method is... 

Bessho, Y. Chip on glass mounting technology of LSIS for LCD module. Proceedings of the International Microelectronics Conference, May 1990 183-189. 

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