Channels manifold/substrate

While the manifolds were fabricated by a plain molding process, the microchannels substrate fabrication was quite complicated and was achieved by a multistage process. The following main stages were used in the process (1) double side oxidation of a 525 pm (1 0 0) silicon substrate to 1,000 A, (2) single side 1,200 A silicon nitride deposition, (3) silicon nitride channels template opening by reactive... 

Once the micro-channels were fabricated, the manifold were bonded to the substrate by epoxy glue, and the resistor was wired by a silver-based epoxy electric conductor and painted with a 1 pm thin paint to increase the surface emissivity. The triangular micro-channels and the unpainted resistor are shown in Fig. 9.12. 

Fig. 10.8 Examples of substrate and manifold channels, flow components, and surface mount components fortheSwagelok MPC NeSSI system.

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