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Chambers, processing load-lock

A schematic of a MALDI-TOF-MS instrument is depicted in Figure 11.2b. Samples, consisting of a few microlitres of analyte solution (with or without matrix), are deposited on a MALDI target (Figure 11.2a). After the solvent has evaporated the sample plate, carrying the solidified samples, is introduced into the MALDI ionization chamber via load-lock. The ionization process takes place in a high-vacuum chamber to which the plate is introduced via a prechamber kept at a pressure lower than atmospheric. Analyte ions are then accelerated as they are formed and pumped into the TOF analyzer, where they are separated based on their mass-to-charge ratio. [Pg.261]

There are several types of deposition chamber configurations (Fig. 2). The batch-type system is the most commonly used, but the requirement that the system be returned or let-up to ambient pressure on each cycle can pose problems in obtaining a reproducible processing environment. The load-lock system and the in-line system allows the deposition chamber to be kept under vacuum at all times and the substrates introduced and removed through... [Pg.513]

Fig. 2. Vacuum processing chamber configuration (a) batch coater (b) load-lock coater (c) in-line coater (d) cluster tool (e) roU coater (batch) and (f) roU coater (air-to-air), [[ccsq]] represents the isolation valve with transfer tooling [[artl]], the motion of fixturing and [[art2]], the access door. Fig. 2. Vacuum processing chamber configuration (a) batch coater (b) load-lock coater (c) in-line coater (d) cluster tool (e) roU coater (batch) and (f) roU coater (air-to-air), [[ccsq]] represents the isolation valve with transfer tooling [[artl]], the motion of fixturing and [[art2]], the access door.
Load Locks - An isolation chamber that allows a process chamber to be protected from ambient conditions. [Pg.637]

The cluster tool system, which is used extensively in semiconductor device processing, uses a central introduction chamber from which the substrates may be moved into separate processing modules through load-locks and transfer tooling. These processing modules may... [Pg.99]

Deposition system, cluster-tool (semiconductor processing) A load-lock vacuum system that has random access to several processing modules from the loading/transfer chamber. [Pg.595]

In-line processing system, closed-ended An in-line system with a load-lock chamber on each end. Often cassettes having multiple substrates can be loaded into the load-lock and then fed through the in-line system. See also In-line processing system, open-ended. [Pg.637]


See other pages where Chambers, processing load-lock is mentioned: [Pg.514]    [Pg.20]    [Pg.243]    [Pg.213]    [Pg.514]    [Pg.418]    [Pg.31]    [Pg.152]    [Pg.210]    [Pg.180]    [Pg.219]    [Pg.297]    [Pg.73]    [Pg.97]    [Pg.98]    [Pg.649]    [Pg.2802]    [Pg.607]   
See also in sourсe #XX -- [ Pg.98 ]




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