BPA bisphenol

Both 2,2-bis(4-hydroxyphenyl)propane (BPA, bisphenol-A) and 2,2-bis(4-hydroxyphenyl)heptane (BP-5) were a gift from Dr M. Metzler (Kaiserlautern, Germany). Mono-, di-, tri- and tetrachlorinated BPA were a gift from Dr J.L. Vilchez (Granada, Spain). 

Fig. 9. Relationship between the steady-state bioconcentration factors on a lipid basis (BCFl) of chemicals in different fish species and the n-octanol/water partition coefficient (Kqw) (log/log scale). ( ) Solid circles are chemicals with known endocrine-disrupting properties. Abbreviations of the chemicals p,p -DDT 2,2-bis-(p-chlorophenyl)-l,l,l-trichloroethane. OCDD octachlorodibenzo-p-dioxin. TCDD tetrachlorodibenzo-p-dioxin. HCB hexachloro-benzene. PCA pentachloroanisole. PeCB pentachlorobenzene. MX musk xylene. TeCB tetrachlorobenzene. NP nonylphenol. TCB tetrachlorobenzene. y-HCH y-hexachlorocyclo-hexane (Lindane). PCP pentachlorophenol. DCB dichlorobenzene. BPA bisphenol-A. PCBs polychlorinated biphenyls...

BPA Bisphenol-A CTPZ Crack tip plastic zone DCG Discontinuous crack growth FCP Fatigue crack propagation... 

A variety of poly/dihydric oils are used for the preparation of glyddyl ether-type epoxy resins. These include bisphenols, namely bisphenol-A (BPA), bisphenol-F (BPF), bisphenol-S (BPS) and bisphenol-H (BPH) and so on. Other aromatic diols and polyols such as phenolic resin, MF resins and hyperbranched polyol may also be used in the preparation of vegetable oil-based epoxy resins. Bisphenol-A (2,2-bis(4-hydroxyphenyl)propane) is one of the most widely used aromatic diols for the synthesis of epoxy resin. The resins are commonly used as lacquers for coated metal products such as food cans, bottle tops and water pipes. There are also reports on the use of bisphenol-S (BPS) (bis(4-hydroxyphenyl) sulphone), in the synthesis of epoxy resin. The advantages of resistance to deformation by heat and improvement of thermal stability were observed for such epoxy resins. The presence of sulphone group (BPS-based epoxy resin) in the epoxy resin exhibits better gel time than BPA-based epoxy. Another important diol, namely bis(4-hydroxydiphenyl)methane or bisphenol-F (BPF) is used for the synthesis of low viscosity epoxy resins. BPF generally comprises several isomers such as bis(2-hydroxylphenyl)methane (i.e. ortho-ortho isomer), bis(4-hydroxylphenyl)methane (i.e. para-para isomer) and... 

MMFSO = Modified Mesua ferrea L. seed oil, BPA = bisphenol-A, TBBPA tetrabromobisphenol-A, BPS = bis(4-hydroxyphenyl) sulphone, EC = epichlorohydrin. 

Abbreviations and symbols BP, biphenyl BPA, bisphenol A DF, dibenzofuran DES, diethylstilbestrol NP, nonylphenol 2-CP, 2-monochlorophenol PBS, poly (butylene succinate) PBT, poly(butylene adipate/terephthalate) PCL, poly(e-caprolactone) PHBV, poly(3-hydroxybutyrate-co-3-hydroxyvalerate) PLA, poly (L-lactic acid) LDPE, low-density polyethylene PET, poly(ethylene terephthalate) +, strongly adsorbed (+), weakly adsorbed —, not adsorbed, figures in parentheses show glass transition temperature. 

Nonylphenol ethoxylate (NPEO), octylphenol ethoxylate (OPEO), alkylphenoxy carboxylate (APEC), halogenated alkylphenols (BrOP, ClOP, BrNP, CINP), halogenated NPEOs (BrNPEOs, ClNPEOs) Bisphenol-A (BPA), bisphenol-F (BPF)... 

Compared to BPA, bisphenol F epoxy resins have lower viscosity, and their cross-linked films have higher and heat distortion temperatures along with better solvent and chemical resistance. Due to these excellent properties coupled with low viscosity, bisphenol F epoxy resins are popular in very high-solid and solvent-free coating systems. 

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