Bonding techniques sealing

R. Bond, Shaft Seal Manufacture—Alternate Molding Techniques. Polymer Processing Society European Regional Meeting, Prague, Czechoslovakia, September 21-24 (1992). 

Method //was designed for a bonded microreactor. After the channel was sealed with a Pyrex top plate using the anodic bonding technique, the liquid precursor was infiltrated into the microreactor through the outlet of the reactor under slight pressure and withdrawn. A thin film of solution remained on the walls of the microchannel. 

The microstructures were realized by a special, advanced turning technique [41]. The platelet stacks were diffusion bonded for sealing and encased in a housing by... 

Numerous sealing/bonding techniques for micro structured metal plates exist and will be discussed below ... 

Most mechanical sensors have to operate in a stable, well controlled environment, thus requiring perfectly sealed cavities. One of the most important achievements of the anodic bonding technique is the fabrication of such hermetically sealed cavities. Anodic bonding can be performed in different atmospheres and at different pressures, which can both be preserved within a sealed cavity. The creation of reliable reference chambers for pressure sensors or for good control of squeeze-film damping [46] are just some of the opportunities offered by this technique. Nevertheless, this technique also faces some challenges, such as the feedthrough of the conductors to and from the sealed cavity. Several solutions have been proposed ... 

MRT produced membranes either as rolled foils or as deposited thin films (8-15 pm). In addition, patented bonding techniques have been developed to permanently attach membranes to support modules with a perfect, hydrogen-tight seal. 

The polymerase chain reaction (PCR) is the most widely used technique for oligonucleotide synthesis. Microchips/microdevices for PCR are studied extensively, and thus great progress has been made in the development and scope of microchip components of microchip-based PCR analyzers such as on-chip micromachining (fabrication, bonding, and sealing), choice of... 

Manufacturing of microreactors from metals, ceramics and plastic was described briefly. The material for the microreactor is chosen in consistence to the process demands as well as with regard to the number of microreactors to be produced. The most common techniques for different material classes—metals, ceramic and glass as well as polymers - have been described or referenced. Aspects like assembling, bonding and sealing have also been integrated into this chapter. However, it is not exhaustive. 

This technique is used, for instance, to bond and seal a window or door frame into the masonry (Fig. 98). We will study this technique further in the chapter Construction Adhesives in Volume 6. 

The wafer bonding technique has been used to encapsulate MEMS devices before the dicing process. Wafers (silicon or glass) with recessed microcavities are used to bond to the MEMS device wafer. The microcavity provides a protection cap to the micromechanical component. The hermetic sealing between the bonded wafers will prevent water (during dicing operation) from coming into the cavity. It will also delay moisture diffusion from the envi-... 

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