Bonded joints behaviour models

Fatigue and fracture of adhesively-bonded composite joints Behaviour, simulation and modelling... 

Finite element methods can also be used to analyse bonded-bolted joints. A high stress concentration exists in angular corners of the adherends. This phenomenon is identical to that encountered in the analysis of bonded joints. Non-linearities in the adhesive and adherends have to be considered. With an FE analysis a more detailed picture of the behaviour of a bonded-bolted joint may be reached than with closed-form analytical methods. However, perfoming FE analyses can be time consuming and their accuracy is dependent on the accuracy of the model, as discussed in 5.3.2.2. 

A mean-square helical hydrophobic moment,

, is defined for polypeptides in analogy to the mean-square dipole moment, , for polymer chains. For a freely jointed polymer chain, is given by X rr , where mi denotes the dipole moment associated with bond /. In the absence of any correlations in the hydrophobic moments of individual amino acid residues In the helix,

is specified by X Wj2, where H denotes the hydrophobicity of residue /, Matrix-generation schemes are formulated that permit rapid evaluation of

and . The behaviour of

I

is illustrated by calculations performed for model sequential copolypeptides. 

In instrumented creep tests taken to failure, one learns not only how long specimens last but also how deformation increases throughout the creep process. For lap joints, delay times have been seen in creep tests, probably due to the increasing uniformity of the shear stress state, as predicted by the shear lag model as the creep compliance of the adhesive increases with time. In other situations, no such delay time is seen. A schematic illustration of a creep curve for an adhesive bond consisting of a butt joint bonded with a pressure sensitive foam tape is shown in Fig. 2, exhibiting classical primary, secondary and tertiary regions of creep behaviour. 

Strength, unlike elastic modulus, is not even theoretically a readily determinable quantity. Overall elastic-plastic deformation in a structural adhesive might be describable in terms of intermolecular forces and models of viscous flow, but not at the discontinuous moment of fracture. In fact overall behaviour loses sight of the fact that it is normally isolated phenomena that control the magnitude of joint strength and the locus of failure (see Stress distribution mode of failure). The term isolated phenomena refers to voids, cracks, second phase material, and so on, which can act as stress concentrators. Clearly, it would be unwise to suggest that an adhesive bond tester should merely locate and size voids and cracks, as whether or not such a defect is active depends upon where it lies in the working stress pattern of the structure. 

The three-dimensional models predict that the stress level can be reduced if the bond line thickness is increased from 25 to 75 or even 175 xm. However, the curves of Figure 50 show, e.g. that the maximum shearing stress decreases by a factor of two, from 33 to 17 MPa, when the thickness of the adhesive layer increases from 25 to 100 xm. A bond line thickness of 50-75 xm is generally recommended for the die attachment because of the negligible thermal impedance penalty. The experimental results indicate that, between 20 and 80 xm, the thickness of the adhesive joint does not greatly affect the thermal transfer capability. This behaviour has been explained by the fact that the interfacial thermal resistances between the adhesive and both the die and the substrate are much higher than that contributed by the bulk thermal conductivity of the adhesive materials. 

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