Bond failure, mechanisms

Structural bonds are those that are expected to undergo some form of loading for a significant part of their service life while non-structural bonds remain largely unloaded, for example, in the case of paints and lacquers. An understanding of the bond failure mechanism is critically important in explaining the performance of a particular bonding system in durability tests. Surface analytical techniques such as X-ray photoelectron spectroscopy (XPS) are widely employed in this role. ... 

Fitzpatrick et al. [41] used small-spot XPS to determine the failure mechanism of adhesively bonded, phosphated hot-dipped galvanized steel (HDGS) upon exposure to a humid environment. Substrates were prepared by applying a phosphate conversion coating and then a chromate rinse to HDGS. Lap joints were prepared from substrates having dimensions of 110 x 20 x 1.2 mm using a polybutadiene (PBD) adhesive with a bond line thickness of 250 p,m. The Joints were exposed to 95% RH at 35 C for 12 months and then pulled to failure. 

Fitzpatrick and Watts [57] also applied imaging TOF-SIMS to deteiTnine the failure mechanisms of adhesively bonded, phosphated hot-dipped galvanized steel... 

At elevated temperatures where titanium alloys could be the adherend of choice, a different failure mechanism becomes important. The solubility of oxygen is very high in titanium at high temperatures (up to 25 at.%), so the oxygen in a CAA or other surface oxide can and does dissolve into the metal (Fig. 12). This diffusion leaves voids or microcracks at the metal-oxide interface and embrittles the surface region of the metal (Fig. 13). Consequently, bondline stresses are concentrated at small areas at the interface and the joint fails at low stress levels [51,52]. Such phenomena have been observed for adherends exposed to 600°C for as little as 1 h or 300°C for 710 h prior to bonding [52] and for bonds using... 

A.H. Muhr, A.G. Thomas, and J.K. Varkey, A fracture mechanics study of natural rubber-to-metal bond failure, J. Adhesion Set TechnoL, 10, 593-616, 1996. 

Other explanations of the nature of the polymer to metal bond include mechanical adhesion due to microscopic physical interlocking of the two faces, chemical bonding due to acid/base reactions occuring at the interface, hydrogen bonding at the interface, and electrostatic forces built up between the metal face and the dielectric polymer. It is reasonable to assume that all of these kinds of interactions, to one degree or another, are needed to explain the failure of adhesion in the cathodic delamination process. 

The extent of adhesive bond failure under corrosive environments is greatly accelerated when cyclic mechanical stresses are imposed on the adhesive bond during exposure. Three to four orders of magnitude reduction in fatigue life of adhesive bonds is observed for bonds exposed to environment prior to fatigue testing. 

Very recently, attempts have been made to develop PP/EOC TP Vs. In order to make TPVs based on PP/EOC blend systems, phenolic resin is ineffective because the latter needs the presence of a double bond to form a crosslinked network structure. Peroxides can crosslink both saturated and unsaturated polymers without any reversion characteristics. The formation of strong C-C bonds provides substantial heat resistance and good compression set properties without any discoloration. However, the activity of peroxide depends on the type of polymer and the presence of other ingredients in the system. It has been well established that PP exhibits a (3-chain scission reaction (degradation) with the addition of peroxide. Hence, the use of peroxide only is limited to the preparation of PP-based TPVs. Lai et al. [45] and Li et al. [46] studied the fracture and failure mechanism of a PP-metallocene based EOC based TPV prepared by a peroxide crosslinking system. Rajesh et al. 

With time (under increased temperature and humidity) the crack tip continues to a weaker region which for this surface treatment appears to be near the oxide/alloy interface. Figure 11 summarizes the analysis of the bond failure for this particular surface treatment. The important aspect here is that under identical conditions, different surface preparations show different modes of failure. Weak boundary layers are not developed using some treatment/bonding combinations. Processes have been developed in which the locus of failure remains in the adhesive ("a cohesive failure") and it is necessary to use a mechanical test in which even more stress is placed on the interfacial region (19). 

Bartz, W.J. and Xu, Jinfen, Wear Behaviour and Failure Mechanism of Bonded Solid Lubricants, Lubric. Eng., 43, 514, (1987). 

This paper presents results from a study of assemblies composed of glass fibre reinforced epoxy composites. First, tests performed to produce mixed mode fracture envelopes are presented. Then results from tests on lap shear and L-stiffener specimens are given. These enabled failure mechanisms to be examined in more detail using an image analysis technique to quantify local strain fields. Finally the application of a fracture-mechanics-based analysis to predict the failure loads of top-hat stiffeners with and without implanted bond-line defects is described. Correlation between test results and predictions is reasonable, but special attention is needed to account for size effects and micro-structural variations induced by the assembly process. 

Fracture mechanics characterisation tests have been performed to determine the mixed mode fracture envelope of an epoxy bonded glass/epoxy composite. Analysis of lap shear, and L-stiffener geometries has shown that for this relatively brittle adhesive reasonable first estimations of failure loads can be obtained for both cracked and uncracked specimens. An image analysis technique has been developed which enables failure mechanisms to be... 

For Al bonds on Au or vice versa, the Kirkendall effect leads to a well known failure mechanism [37]. The Kirkendall effect results from the different diffusion coefficients of Au and Al in different phases of the system AlAu [38]. The Al2Au phase ( purple phase ), which is always present, plays a crucial role. The diffusion coefficient of Al through Al2Au is much higher than that of Au. As a result, voids are created as soon as the temperature reaches the diffusion temperature, which reduces the stability of the bond contact. 

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