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Copper basis material

Galvanized basis material means zinc coated steel, galvanized brass, and other copper base strip that is processed in coil coating. [Pg.303]

U.S. Environmental Regulations for the Copper Basis Material Subcategory... [Pg.335]

Table 8.33 presents the NSPS of the copper basis material subcategory. Any new source must achieve the NSPS. [Pg.335]

Any new source of the copper basis material subcategory that introduces pollutants into a POTW must achieve the pretreatment standards listed in Table 8.34.7... [Pg.335]

Effluent Pretreatment Standards of a New Source of the Copper Basis Material Subcategory that Introduces Pollutants into a POTW... [Pg.341]

The alloy aluminium-4 wt% copper forms the basis of the 2000 series (Duralumin, or Dural for short). It melts at about 650°C. At 500°C, solid A1 dissolves as much as 4 wt% of Cu completely. At 20°C its equilibrium solubility is only 0.1 wt% Cu. If the material is slowly cooled from 500°C to 20°C, 4 wt% - 0.1 wt% = 3.9 wt% copper separates out from the aluminium as large lumps of a new phase not pure copper, but of the compound CuAlj. If, instead, the material is quenched (cooled very rapidly, often by dropping it into cold water) from 500°C to 20°C, there is not time for the dissolved copper atoms to move together, by diffusion, to form CuAlj, and the alloy remains a solid solution. [Pg.324]

Whilst the conductivity of these polymers is generally somewhat inferior to that of metals (for example, the electrical conductivity of polyacetylenes has reached more than 400 000 S/cm compared to values for copper of about 600 000 S/cm), when comparisons are made on the basis of equal mass the situation may be reversed. Unfortunately, most of the polymers also display other disadvantages such as improcessability, poor mechanical strength, poor stability under exposure to common environmental conditions, particularly at elevated temperatures, poor storage stability leading to a loss in conductivity and poor stability in the presence of electrolytes. In spite of the involvement of a number of important companies (e.g. Allied, BASF, IBM and Rohm and Haas) commercial development has been slow however, some uses have begun to emerge. It is therefore instructive to review briefly the potential for these materials. [Pg.888]

In alkaline solution biuret, HN(CONH2)2 reacts with copper(II) sulfate to give a characteristic violet colour due to the formation of the complexes [Cu2(/l-OH)2(NHCONHCONH)4] (Fig. 28.6a) and [Cu(NHCONHCONH)2] . This is the basis of the biuret test in which an excess of NaOH solution is added to the unknown material together with a little CUSO4 soln a violet colour indicates the presence of a protein or other compound containing a peptide linkage. [Pg.1191]

Chemical reduction is used extensively nowadays for the deposition of nickel or copper as the first stage in the electroplating of plastics. The most widely used plastic as a basis for electroplating is acrylonitrile-butadiene-styrene co-polymer (ABS). Immersion of the plastic in a chromic acid-sulphuric acid mixture causes the butadiene particles to be attacked and oxidised, whilst making the material hydrophilic at the same time. The activation process which follows is necessary to enable the subsequent electroless nickel or copper to be deposited, since this will only take place in the presence of certain catalytic metals (especially silver and palladium), which are adsorbed on to the surface of the plastic. The adsorbed metallic film is produced by a prior immersion in a stannous chloride solution, which reduces the palladium or silver ions to the metallic state. The solutions mostly employed are acid palladium chloride or ammoniacal silver nitrate. The etched plastic can also be immersed first in acidified palladium chloride and then in an alkylamine borane, which likewise form metallic palladium catalytic nuclei. Colloidal copper catalysts are of some interest, as they are cheaper and are also claimed to promote better coverage of electroless copper. [Pg.436]

Why Do We Need to Know This Material The d-block metals are the workhorse elements of the periodic table. Iron and copper helped civilization rise from the Stone Age and are still our most important industrial metals. Other members of the block include the metals of new technologies, such as titanium for the aerospace industry and vanadium for catalysts in the petrochemical industry. The precious metals—silver, platinum, and gold—are prized as much for their appearance, rarity, and durability as for their usefulness. Compounds of d-block metals give color to paint, turn sunlight into electricity, serve as powerful oxidizing agents, and form the basis of some cancer treatments. [Pg.776]

From the standpoint of the relationship of almost all animal life, the transport of oxygen by heme (also written as haem in some literature) is the basis for respiration. Heme is one of several proteins that contain iron. Others include materials such as myoglobin, ferritin, transferritin, cytochromes, and ferrodoxins. In order to transport the oxygen required, the body of an average adult contains approximately 4 grams of iron. In species such as mollusks, oxygen is transported by proteins that contain copper instead of iron. These are sometimes referred to as the copper blues. The structure of heme is shown in Figure 22.19. [Pg.807]

Be careful about ruling out materials on the basis of quantity alone. Mixing liquid waste materials in 55-gallon drums has resulted in numerous incidents. Acetylene in contact with copper can produce shock-sensitive copper acetylides, which can be dangerous in very small quantities. [Pg.206]

While the amount of electricity that can be conducted by polymer films and wires is limited, on a weight basis the conductivity is comparable with that of copper. These polymeric conductors are lighter, some are more flexible, and they can be laid down in wires that approach being one-atom thick. They are being used as cathodes and solid electrolytes in batteries, and potential uses include in fuel cells, smart windows, nonlinear optical materials, LEDs, conductive coatings, sensors, electronic displays, and in electromagnetic shielding. [Pg.589]

Albumin is a major transport facilitator of hydrophobic compounds which would otherwise disrupt cellular membranes. These compounds include free fatty acids and bilirubin as well as hormones such as cortisol, aldosterone, and thyroxine when these materials have exceeded the capacity of proteins normally associated with them. Albumin also binds ions, including toxic heavy metals and metals such as copper and zinc which are essential for normal physiological functioning but may be toxic in quantities in excess of their binding capacity for their carrier proteins. Binding of protons is the basis for the buffering capacity of albumin. [Pg.235]


See other pages where Copper basis material is mentioned: [Pg.144]    [Pg.15]    [Pg.144]    [Pg.277]    [Pg.854]    [Pg.854]    [Pg.144]    [Pg.627]    [Pg.287]    [Pg.558]    [Pg.159]    [Pg.36]    [Pg.790]    [Pg.605]    [Pg.43]    [Pg.347]    [Pg.121]    [Pg.271]    [Pg.170]    [Pg.304]    [Pg.7]    [Pg.70]    [Pg.140]    [Pg.41]    [Pg.78]    [Pg.234]    [Pg.49]    [Pg.243]    [Pg.121]    [Pg.145]    [Pg.735]    [Pg.214]    [Pg.161]    [Pg.563]   
See also in sourсe #XX -- [ Pg.335 ]




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Basis material

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