Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Base metal surface preparation

Wastewater from porcelain enameling on steel is generated by base metal surface preparation, enamel application, ball milling, and related operations. The constituents in the wastewater include the base material being coated (iron), as well as the components of the surface treatment solutions and enamels being applied. [Pg.311]

All full-penetration, pressure-containing welds are 100% radiographed to the standards of Section III of the ASME Boiler and Pressure Vessel Code. Weld preparation areas, back-chip areas, and final weld surfaces are magnetic-particle or dye-penetrant examined. Other pressure-containing welds, such as used for the attachments of nonferrous nickel-chromium-iron mechanism housings, vents, and instrument housings to the reactor vessel and head, are inspected by liquid-penetrant tests of the root pass, the lesser of one-half of the thickness or each 1/2-inch of weld deposit, and the final surface. Additionally, the base metal weld preparation area is magnetic-particle examined prior to overlay with nickel-chromium-iron weld metal. [Pg.89]

Aluminum is painted for both protective and decorative purposes. As with any metal, surface preparation is extremely important. Conversion coatings, either of the chromate or phosphate type, are recommended for the preparation of aluminum alloys. In environments containing chlorides a chromated primer should be applied first. Water base paints are particularly suitable for use with aluminum alloys (see Chapter 7). [Pg.59]

The surface preparation must enable and promote the formation of bonds across the adherend/primer-adhesive interface. These bonds may be chemical (covalent, acid-base, van der Waals, hydrogen, etc.), physical (mechanical interlocking), diffusional (not likely with adhesive bonding to metals), or some combination of these (Chapters 7-9). [Pg.947]

Depositing, in a vacuum, a thin layer of vaporized metal (generally aluminum) on a surface prepared by a base coat. [Pg.540]

Recently, another template-based technique for preparation of metallic nanoparticles on electrode surfaces was described [18]. This technique does not need any nanomanipulation by STM or AFM. It is based on reduction... [Pg.321]

Electrocatalytic activity of supported metal particles has been investigated on surfaces prepared in an ultrahigh vacuum (UHV) molecular beam epitaxy system (DCA Instruments) modified to allow high throughput (parallel) synthesis of thin-film materials [Guerin and Hayden, 2006]. The system is shown in Fig. 16.1, and consisted of two physical vapor deposition (PVD) chambers, a sputtering chamber, and a surface characterization chamber (CC), all interconnected by a transfer chamber (TC). The entire system was maintained at UHV, with a base pressure of 10 °mbar. Sample access was achieved through a load lock, and samples could be transferred... [Pg.572]

Several processes are used in the porcelain enameling industry regardless of the metal being coated. These processes, discussed below, include preparation of the enamel slip, surface preparation of the base material, and enamel application and firing to fuse the coating to the metal.3 6... [Pg.307]

Figure 9.60 Many different thiol-containing linkers can be used to prepare water-soluble QDs. The monothiol compounds suffer from the deficiency of being easily oxidized or displaced off the surface, thus creating holes for potential nonspecific binding. The dithiol linkers are superior in this regard, as they form highly stable dative bonds with the semiconductor metal surface that do not get displaced. The PEG-based linkers are especially effective at creating a biocompatible surface for conjugation with biomolecules. Figure 9.60 Many different thiol-containing linkers can be used to prepare water-soluble QDs. The monothiol compounds suffer from the deficiency of being easily oxidized or displaced off the surface, thus creating holes for potential nonspecific binding. The dithiol linkers are superior in this regard, as they form highly stable dative bonds with the semiconductor metal surface that do not get displaced. The PEG-based linkers are especially effective at creating a biocompatible surface for conjugation with biomolecules.
The history of the observation of anomalous voltammetry is reviewed and an experimental consensus on the relation between the anomalous behavior and the conditions of measurement (e.g., surface preparation, electrolyte composition) is presented. The behavior is anomalous in the sense that features appear in the voltammetry of well-ordered Pt(lll) surfaces that had never before been observed on any other type of Ft surface, and these features are not easily understood in terms of current theory of electrode processes. A number of possible interpretations for the anomalous features are discussed. A new model for the processes is presented which is based on the observation of long-period icelike structures in the low temperature states of water on metals, including Pt(lll). It is shown that this model can account for the extreme structure sensitivity of the anomalous behavior, and shows that the most probable explanation of the anomalous behavior is based on capacitive processes involving ordered phases in the double-layer, i.e., no new chemistry is required. [Pg.37]

Flytzani-Stephanopoulos and coworkers—urea method for preparing high surface area ceria/substituting noble metals with base metals/cationic active sites for Au and Pt-ceria catalysts/deactivation by hydroxycarbonates and improved stability with 02 co-feeding. Li et al.396 reported on low temperature water-gas shift catalysts in their search for a replacement catalyst for Cu/ZnO suitable for use in a fuel... [Pg.225]


See other pages where Base metal surface preparation is mentioned: [Pg.783]    [Pg.294]    [Pg.185]    [Pg.185]    [Pg.194]    [Pg.2748]    [Pg.348]    [Pg.335]    [Pg.222]    [Pg.166]    [Pg.126]    [Pg.12]    [Pg.25]    [Pg.120]    [Pg.983]    [Pg.468]    [Pg.562]    [Pg.564]    [Pg.895]    [Pg.110]    [Pg.232]    [Pg.168]    [Pg.386]    [Pg.52]    [Pg.55]    [Pg.2]    [Pg.227]    [Pg.333]    [Pg.185]    [Pg.307]    [Pg.309]    [Pg.1207]    [Pg.48]    [Pg.305]    [Pg.502]    [Pg.243]    [Pg.31]    [Pg.212]    [Pg.94]   
See also in sourсe #XX -- [ Pg.311 ]




SEARCH



Base surface

Bases preparation

Metal preparation

Surface preparation

© 2024 chempedia.info