Automotive industry, lead-free solders

Other lead-free solder alloys which have been developed and evaluated by fee industry include Sn-Ag, Sn-Ag-Bi, Sn-Bi-In, and other ternary and quaternary alloys (Ref 24-33). The use of alloys containing indium (In) may be limited due to fee scarcity of indium and its high cost. The eutectic Sn-Ag alloy (melting temperature 221 °C, or 429 °F) was qualified for automotive applications in fee 1990s on ceramic thick film substrates and PWBs (Ref 3,12-15,34- 5). The microstructural characteristics of the Sn-Ag-Cu system under different reflow conditions and... [Pg.4]

Visteon Announces Production of the Automotive Industry s First Lead-Free Solder Electronic Module, Visteon Press Release, Dec 18, 2000... [Pg.23]

Winterbottom, W.L. Converting to lead-free solders an automotive industry perspective. J. Met. 1993, 45 (7), 20-24. [Pg.46]

Siemens initiated lead-free solder development activities in the mid-1990s. The first Siemens demonstrators using lead-free solder included industrial PCs, automotive, and telecommunications products. These products all have double-sided SMT boards with complete lead-free solutions. The smallest component is a 0402 device and the largest is a QFP with a 0.5-mm pitch. After analyzing 162 different alloys, Siemens selected three. The melting point for the Sn-3.8Ag-0.7Cu alloy was too high therefore Siemens added bismuth or another element to lower the melting point. [Pg.162]

Big Chemical Encyclopedia