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Assembly process Insertion technology

An additional functional station, for example for inserting and assembly processes is also gained by the cube technology The 4-sided middle plate of the mold is turning by a vertical rotary axis. [Pg.72]

By comparison with the processes described in Section 7.3.5, the manufacture of LDS parts with steel tools with nonhardened inserts is the most complicated. The upside is that MID quality is comparable to that of subsequent series production. The surface quality of the moldings is such that there is no overmetahization. Even ultrahigh requirements with regard to superfine conductor widths and subsequent processes of assembly and connection technology such as chip-assembly processes are fully satisfied. [Pg.214]

Surface-mount technology replaces previous methods of inserting component leads into plated through-holes of PWBs, wave soldering from the back side to flow solder into the holes, and simultaneously forming both mechanical and electrical connections. SMT is highly automated and currently the most widely used production process for the assembly of single-layer, double-sided, and multilayer circuit boards. [Pg.10]

Adaptronic Strut. Process loads as well as errors in manufacturing and assembly of machine components cause the displacement of a machine tools tool-center point, which influences its accuracy of work in a negative way. Since in many cases an improvement of the production accuracy of machine components is not favorable either for economic or for technological reasons, the insertion of active components that autonomously register a state of load or deformation and can perform a corresponding compensation movement. [Pg.423]


See other pages where Assembly process Insertion technology is mentioned: [Pg.349]    [Pg.429]    [Pg.80]    [Pg.392]    [Pg.187]    [Pg.423]    [Pg.327]    [Pg.19]    [Pg.11]    [Pg.725]    [Pg.50]    [Pg.10]    [Pg.20]    [Pg.83]    [Pg.725]    [Pg.95]    [Pg.365]    [Pg.11]    [Pg.21]    [Pg.773]    [Pg.292]    [Pg.910]    [Pg.138]    [Pg.77]    [Pg.604]    [Pg.53]   
See also in sourсe #XX -- [ Pg.13 , Pg.40 ]




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