Applications of electrodepositable resists

The micelle size produced depends on the temperature and ionizer content at inversion, since emulsion formation here is irreversible. After inversion has taken place, the remaining water can be added faster, since no further change in micelle size occurs. 

with efficient control, emulsions with the desired micelle size, conductivity and solids content can be obtained. Solids content is usually in the 10-25% range. 

At this stage some resists can be ultrafiltered to remove the water-soluble polymerization solvent. Ultrafiltration removes small molecules, but large aggregations of molecules (i.e. micelles) cannot pass through the membrane. Small amounts of other, water-soluble resist components may also be removed, but this can be compensated for by adding slightly more of them at the beginning. 

Ultrafiltration tends to increase the manufacturing costs somewhat, but lowers the VOC (volatile organic content) and simplifies bath control during processing (section 2.2.1). 

With the growing use of surface mount technology and related techniques such as chip-on-board, printed circuit board manufacturers are continually seeking new processes to enable production of boards with increased circuit densification and decreased circuit feature sizes. Consequently, line widths are now approaching those of early semiconductor devices, and this has in turn placed new demands on the resolution capabilities of the inner-layer and outer-layer photoresists used in the industry. 

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