Analysis debonding

Sometimes the failure occurs by propagation of a crack that starts at the top and travels downward until the interface is completely debonded. In this case, the fracture mechanics analysis using the energy balance approach has been applied [92] in which P, relates to specimen dimensions, elastic constants of fiber and matrix, initial crack length, and interfacial work of fracture (W,). 

XPS analysis (Fig. 6), in conjunction with SEM examination of the failed debonded sides, identified the true modes of failure. The SAA control (hydrated oxide on both sides under SEM high A1 and 0 levels on both sides) failed within the oxide. Examination of the specimen treated with multilayer-forming 5000 ppm NTMP solution (distinct "metal" and "adhesive" sides under SEM high A1 and 0, low C levels on "metal" side high C, low A1 and 0 levels on "adhesive" side) indicated that the failure occurred between the metal and the adhesive (i.e., adhesive failure). 

Although distinct "metal" and "adhesive" sides were apparent upon visual examination of the debonded surfaces treated with 100 ppm NTMP, SEM analysis showed the presence of an adhesive layer on the "metal" side. XPS analysis indicated low A1 and 0 and identical high C levels on both debonded sides, confirming a failure within the adhesive layer (cohesive failure), i.e., the best possible performance in a given adherend-adheslve system. This result is similar to that obtained using a 2024 A1 alloy prepared by the phosphoric acid-anodization (PAA) process (16) and indicates the importance of monolayer NTMP coverage for good bond durability (Fig. 4). 

Figure 6. XPS surface analysis results for debonded SAA 7075-T6 aluminum specimens.

XPS analysis of the debonded specimens showed that the unprimed and primed FPL control and mercaptosilane-treated specimens failed primarily within the oxide, which represented the weakest layer in the system. On the other hand, the NTMP-treated sample debonded between the oxide and the polyamide primer. 

O Brien, T.K. (1985). Analysis of local deaminations and their influence on composite laminate behavior. In Delamination and Debonding of Materials, ASTM STP 876 (W.S. Johnson, ed.) ASTM, Philadelphia, PA. p 282. 

The interface debond criterion used in this analysis is based on the concept of fracture mechanics where the strain energy release rate against the incremental debond length is equated to the interface fracture toughness, Gk, which is considered to be a material constant... 

More recently, Stang and Shah (1986) derived a debond criterion based on a compliance analysis, and Wells and Beaumont (1985) took into account the effect of the Poisson contraction of the fiber and non-linear friction in the debonded region. 

One of the major differences between the results obtained from the micromechanics and FE analyses is the relative magnitude of the stress concentrations. In particular, the maximum IFSS values at the loaded and embedded fiber ends tend to be higher for the micromechanics analysis than for the FEA for a large Vf. This gives a slightly lower critical Vf required for the transition of debond initiation in the micromechanics model than in the FE model of single fiber composites. All these... 

There are many features in the analysis of the fiber push-out test which are similar to fiber pull-out. Typically, the conditions for interfacial debonding are formulated based on the two distinct approaches, i.e., the shear strength criterion and the fracture mechanics approach. The fiber push-out test can be analyzed in exactly the same way as the fiber pull-out test using the shear lag model with some modifications. These include the change in the sign of the IFSS and the increase in the interfacial radial stress, (o,z), which is positive in fiber push-out due to expansion of the fiber. These modifications are required as a result of the change in the direction of the external stress from tension in fiber pull-out to compression in fiber push-out. 

Gray, R..1. (1984). Analysis of the effect of embedded fiber length on the fiber debonding and pull-out from an elastic matrix. J. Mater. Sci. 19, 861-870. 

Marshall, D.B. (1992), Analysis of fiber debonding and sliding experiments in brittle matrix composites. Acta Metall. Mater. 40. 427-442. 

In spite of the imperfections of the approach, the reversible work of adhesion can be used for the characterization of matrix/filler interactions in particulate filled polymers. Debonding is one of the dominating micromechanical processes in these materials. Stress analysis has shown that debonding stress (a ) depends on the reversible work of adhesion [8], i.e. ... 

Recently, stress analysis has been carried out for the determination of stress distribution around inclusions in particulate filled composites. A model based on the energy analysis has led to the determination of debonding stress [8]. This stress, which is necessary for the separation of the matrix and filler, was shown to depend on the reversible work of adhesion (see Eq. 16) and it is closely related to parameter B. 

The fiber modulus and matrix shear modulus are also required for the analysis. The fiber s coordinates are recorded directly from the stage controllers to the computer. The operator begins the test from the keyboard. The x and y stages move the fiber end to a position directly under the debonder tip the z stage then moves the sample surface to within 4 yum of the tip. The z-stage approach is slowed down to 0.04 jan/step at a rate of 6 steps/s. The balance readout is monitored, at a load of 2 g the loading is stopped, and the fiber end returned to the field of view of the camera. The location of the indent is noted and corrections are made, if necessary, to center the point of contact. Loading is then continued from 4 g in approximately 1 g increments. Debond is determined to have occurred when an interfacial crack is visible for 90-120° on the fiber perimeter. The load at which this occurs is used to calculate the interfacial shear stress at debond. 

The XPS analysis of the samples primed at 34% RH indicated that there was a consistent failure of the wedge samples which occurred mainly within the alkoxide layer in all systems. Partial hydrolysis may have resulted in the formaton of a weak hydrated oxide layer and was the zone through which the crack propagated to debond the samples. Based on the relative humidity in the chamber during the priming process and the failure surface analysis results, it was concluded that this level of 34% RH was not sufficient to complete the hydrolysis of the alkoxides and produce a stabilized oxide structure. As noted above, however, the wedge crack results did not indicate any instability. 

Now that the top-down internal state variable theory was established, the bottom-up simulations and experiments were required. At the atomic scale (nanometers), simulations were performed using Modified Embedded Atom Method, (MEAM) Baskes [176], potentials based upon interfacial atomistics of Baskes et al. [177] to determine the conditions when silicon fracture would occur versus silicon-interface debonding [156]. Atomistic simulations showed that a material with a pristine interface would incur interface debonding before silicon fracture. However, if a sufficient number of defects were present within the silicon, it would fracture before the interface would debond. Microstructural analysis of larger scale interrupted strain tests under tension revealed that both silicon fracture and debonding of the silicon-aluminum interface in the eutectic region would occur [290, 291]. 

Another important result from the atomistic simulations was that the stress-strain response of a region of material around an interface that debonded could be represented by an elastic fracture analysis at the next higher size scale if the interface was assumed to be larger than 40 A. Hence, an elastic fracture criterion was used in the microscale finite element analysis, which focused on void-crack... 

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