Alkali-developable base polymers carboxylic acid

Alkali-Developable Base Polymers. Since the dissolution rate of PAAs is too fast in 2.38% TMAH solution, the photosensitive system composed of PAA and a DNQ compound suffers from low contrast of the difference in dissolution rate between exposed and unexposed area. It implies that the optimization of the dissolution rate of base polyimide precursor in the developer is needed. PAA/PAE blends, PAA/PAE copolymer, and PAE with pendant carboxylic acid (PAE-COOH) were evaluated as base polymers for photosensitive polyimides. 

Positive Photoresists. Positive resists are entirely different from negative resists. For the purposes of this discussion we restrict ourselves to visible-light-sensitive materials. Typically, these materials are mixtures of low-molecular-weight phenol-formaldehyde polymers and derivatives of naphtho-1,2-quinone diazide, the photosensitive component. The former is soluble in aqueous alkali, but the presence of the latter, a hydrophobic species, inhibits attack of this developer on the film. On irradiation the "sensitizer" is converted to a ketene, which, after reaction with water, forms a base-soluble carboxylic acid. Thus the irradiated part of the film is rendered soluble in the developer and it can be removed selectively. The important feature of this system is that the unirradiated areas are not swollen by the developer and the resolution of this material is quite high. It is possible to prepare gratings having several... 

We report on the positive alkali-developable photosensitive polyimides based on an alkali-soluble polyimide precursor as a base polymer and diazonaphthoquinone (DNQ) sensitizer to improve process stability and sensitivity. Polyamic acid ester with pendant carboxylic acid (PAE-COOH) showed good dissolution behavior in aqueous alkali developer. The dissolution rate of PAE-COOH was controlled by the content of pendant carboxylic acid. It was found that a photosensitive system composed of butyl ester of PAE-COOH and a DNQ compound can avoid the residue at the edge of hole patterns (footing) after development, while that of methyl ester of PAE-COOH showed the residue. A DNQ compound containing sulfonamide derived from diaminodiphenylether renders improved sensitivity compared with DNQ compounds derived from phenol derivatives. 

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