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Adhesives in Electronics

Advanced adhesives in electronics Materials, properties and applications... [Pg.569]

TECHNOLOGY ASSESSMENT ASSOCIATES P.O. Box 1362, Amherst NH 03031-9939, (603) 673-0312. A number of studies on Adhesives in Electronics, Bonding and Joining Composites, Markets for Adhesive Tapes and Films, Conductive Adhesives, Aerospace Sealants, and Growth Markets for Adhesives. [Pg.51]

Melt blending poly(phenylene ether), poly(styrene) and curable epoxy resins yields materials that are suitable for use as adhesives in electronics applications. In particular, the composition is useful in laminating films for electronic applications. [Pg.157]

Epoxies are the most widely used adhesives in electronics assembly, followed by silicones and polyimides. The use ofthese adhesive types, along with the more specialized types such as cyanate esters, bismaleimides, and modified cyclo-olefin thermosets, is expected to increase as the total production of electronic circuits and hardware increases. In recent years, the total value of electronic components has increased tremendously from 59 billion in 1989 to an estimated 215 billion in 2003. It is predicted that the cumulative growth will be 5% to 10% per year. Adhesives for electronics... [Pg.34]

Advanced adhesives in electronics Materials, properties and applications Edited by M. 0. Alam and C. Bailey... [Pg.528]

Detailed information on the appropriate volumes, application, and use of adhesives in electronic manufacturing is beyond the scope of this chapter. The reader wishing further information is referred to Prasad. [Pg.1306]

Ritchie, B., Loctite Corporation, Process Requirements for Solvent-Free UV Conformal Coatings, Adhesives in Electronics 96, Second International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Stockholm, Sweden, June 1996. [Pg.985]

Fig. 2 shows one large application of adhesives in electronic goods that is now a very large market for high-performance adhesives and potting compounds. Fig. 3 shows an enlargement of the epoxy adhesive film on a bonded aluminum honeycomb. [Pg.8]

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