Adhesive bond model

Figure 9. Model of Adhesive Bond Showing Impurities and Additives...

Figure 8. Model of adhesive bond showing applications of spectroscopy and...

Jones, W. C., et al., Use Multiple Regression Analysis to Develop Preductive Models for Failure Times of Adhesive Bonds at Constant Stress, Journal of Applied Polymer Science, vol. 18,1974, p. 555. 

Polyimide friction. The friction of polymers consists of an adhesion component and a deformation component. The adhesion component arises from the shearing of adhered junctions and is usually modeled as the product of the real area of contact and the shear strength of the polymer. The deformation component arises from the frictional work required to balance the energy dissipated in plastic deformation. Some Investigators have developed friction models in which the adhesive bonds at the junctions Increase the amount of plastic deformation over that which would exist in the absence of these bonds (13). 

The main advantage of using Eq. (2) is its availabihty in most commercial finite element codes. However, it does not include the reversible part of creep deformation, so a drop to zero of the applied stress due to load variations on the structure will not lead to back-deformation of the adhesive bond in a model. Viscoelastic material models containing time history must be used in such a case. 

Although important for structural adhesive bonds, fracture mechanics is not as critical for non-structural low load-bearing adhesives as used in most electronic modules. For the most part, passing minimum specification requirements for peel and tensile strengths both at ambient conditions and accelerated test conditions are sufficient. However, computer-simulated modeling and reliability analysis have been used for evaluating electrically conductive adhesives as used in electronics assembly. ... 

Lei and Wilson [35,67] developed a model for the fracture toughness K j of flakeboards bonded with PF resin adhesive. The model is based on the initial crack length a) in the specimen, the average size of the inherent flaw (S2) in the solid wood, the expected increase in crack length resulting from nonbonded interflake cracks and voids (Au), and the Kjc value of the wood used to make the flakes ... 

Fatigue and fracture of adhesively-bonded composite joints Behaviour, simulation and modelling... 

For the monomer polymerization at room temperature, the adhesive was augmented with a redox system of 3% BP and 0.75% DMA. To study, explain, and predict the development of the elastic failure of the polymer in the adhesive interlayer, an improved method of investigating adhesive layer crack resistance with modeling of the formation and growth of a crack at the adhesive-honded joint loading was used [119]. Five adhesive-bonded joints with the adhesive mixture compositions shown in Table 3.1 were subjected to static tests for crack resistance at room temperature. The characteristics of the static crack resistance of the adhesive-bonded joint Kic is the coefficient of the stresses intensity Gic is the intensity of the elastic energy release ic is the opening in the crack tip) were determined at the moment of onset of the crack in double-cantilever specimens DCB (Fig. 3.5). The specimen cantilevers were made of PMMA of TOCH type. 

Ouyang, Z. and Li, G. (2009) Cohesive zone model based analytical solutions for adhesively bonded pipe joints under torsional loading. International Journal of Solids and Structures, 46, 1205-1217. 

Klaibring, A. (1991) Derivation of a model of adhesively bonded joints by the asymptotic expansion method. International Journal of Engineering Science, 29, 493-512. 

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