Accelerated reliability tests

Figure 5.28 Accelerated reliability tests for smart cards. Source VTT Electronics.

Suggesting and carrying out an accelerated reliability test of item is another option. However, this method is not included in this paper and represents a separate methodology. All terms mentioned here are in accordance with the lEC 60050/191 and its further editions. 

Underfill. An underfill is then injected into the gap between the chip and chip carrier and then cured to complete the flip chip process. The function of the underfill or encapsulation as it is sometimes referred to is to provide mechanical integrity and environmental protection to a flip chip assembly. Studies have demonstrated that both thermoset and thermoplastic ICAs can offer low initial joint resistances of less than 5 mS2 and stable joint resistances (Au-to-Au flip chip bonding) during all the accelerated reliability testing listed in Table 1. The reliability results have indicated that there is no substantial difference in the performance of thermoset and thermoplastic bumps and both types of polymers apparently offer reliable flip chip electrical interconnections (53). 

IPC-SM-785, Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments, Nov. 1992. 

The rapid developments in electronics, especially in the last decade, have initiated the inception of electronics reliability (O Connor Kleyner, 2011). Conventionally used accelerated reliability tests have lost their significance time consuming and expensive feature of these tests is against the demands of today s very rapid electronic product cycles (Pecht, 2010). This underlines the importance of using the product s field return data for reliability analysis that is relatively cheap and time saving (Kleyner Sandbom, 2004 Wu, 2012). In this study, we propose a complete reliability methodology exploiting field return data of electronic boards. 

Accelerated reliability tests are often used for predicting the useful life of the solder interconnects. The primary consideration for designing an accelerated testing profile is to maximize... 

Complicating the picture further is the use of different solder alloys on the same board (such as SAC for reflow and tin-copper for wave soldering). Detailed discussions on accelerated reliability testing methodology can be found in Chapter 7. 

The GIDEP Reliability-maintainability Data Bank (RMDB) has failure rates, failure modes, replacement rates, mean time between failure (MTBF) and mean time to repair (MTTR) on components, equipment, subsystems and systems. The RMDB includes field experience data, laboratory accelerated life test data, reliability and maintainability demonstration test results. The... 

Accelerated drug approval, 13 700-701 Accelerated life testing, for reliability, 26 991... 

Tardif R. Reliability of accelerated storage tests to predict stability of vitalimes (A, Bl, C) in tablets. J Pharm Sci 1965 54 281-284. 

Accelerated aging tests for optoelectronic devices are typically carried out at 70 or 85 °C for 2000-5000 h, e.g. based upon Telcordia (Bellcore) standards GR-468-CORE, Reliability Assurance Requirements for Optoelectronic Devices... 

Long-hand numerical work-up, error recognition, and reliability is illustrated with two examples thermal decomposition of hexaphenylethane and an accelerated decomposition test of an herbicide. 

These molding compounds were also used to encapsulate electronic devices for reliability testing. In Figures 4, 5, and 6, stable bromine CEN outperformed "state-of-the-art" resins in the bias pressure cooker device test (BPC), high temperature storage device test (HTS), and the highly accelerated stress test (HAST). 

---