Time-resolved ellipsometric

Spectroscopic ellipsometry is a non-destructive, interface sensitive, in situ technique for interface characterization. Time resolved ellipsometric spectroscopy was used to determine the mechanism of electrochemical deposition of photoresists on copper electrodes under potentiostatic, anodic conditions. Nucleation of photoresist deposition occurs randomly. During the early stages of nucleation the semi-spherical particles are separated by about 100 A. The deposits tend to grow like "pillars" up to 50 A. Further growth of the "pillars" lead to coalescence of the photopolymer deposits. 

A smooth electrode surface for the time resolved ellipsometric spectroscopy was prepared as follows a 7059 glass slide was degreased by soaking in methanol for one hour, dried and placed in a sputter deposition chamber. High purity(99.999%) copper was sputtered in an argon atmosphere of 5 mTorr. The thickness of the copper was determined to be in the range of 4000 -4500 A. 

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