Thin writing process

The requirements of thin-film ferroelectrics are stoichiometry, phase formation, crystallization, and microstmctural development for the various device appHcations. As of this writing multimagnetron sputtering (MMS) (56), multiion beam-reactive sputter (MIBERS) deposition (57), uv-excimer laser ablation (58), and electron cyclotron resonance (ECR) plasma-assisted growth (59) are the latest ferroelectric thin-film growth processes to satisfy the requirements. 

There are a number of difficulties involved with the comparative analysis of Khat samples. At the time of writing, there are no detailed reports in the literature of optimized methods for comparison of such materials. While thin layer chromatographic methods have been used, this technique suffers from lack of resolution. Coupled to the problems associated with artefact formation during the process of analysis, it still remains difficult to achieve a meaningful comparison with any degree of certainty. 

Thermal laser CVD involves the same chemical deposition processes that occur in thermal CVD. It, therefore, is applicable to depositing the same types of materials that the thermal CVD process does. Its major application is the direct writing of thin films in semiconductor processing. 

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