Thin film head production process

Metal in gap (MIG) or ferrite heads are produced with a combination of machining, bonding, and thin-film processes. Thin-film inductive heads are manufactured using thin-fihn processes similar those of semiconductor 1C technology (discussed in Chapter 19). The thin-film head production process is rather unusual, as it involves both very thin and very thick films. We choose to present here a detailed summary of the fabrication process of thin-film inductive heads with a single-layer spiral coil. This may serve, once again to, illustrate the centrally important role of electrochemical deposition in connection with modem information technology. 

The manufacture of thin film products does not only apply to the making of integrated circuits but also magnetic bubble memories, thin film recording heads, tapes and disks. The physical and chemical processes carried out involve heat and mass transfer, momentum transfer, surface phenomena, high temperature chemistry, radiation, etc. Although the material discussed in this book focuses on the manufacture and fundamentals of integrated circuits, many of the basics are applicable to the fabrication of other thin film devices. 

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