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Thermal vacuum deposition

The method of thermal vacuum deposition has been used to obtain tin and silicon deposit on TEG surface. The main difficulty at metal component deposition on graphite support is to obtain uniform metal coating on the surface of disperse particles. The system of uninterrupted mixing of TEG powder during the material evaporation has been created. Its principle... [Pg.361]

TEG-Si, TEG-Sn and dispersed natural graphite-Sn have been prepared by thermal vacuum deposition under continuos mixing. [Pg.362]

The X-ray phase analysis of the CMs obtained by these methods (Fig. 8) showed that the modifier coating is pure tin. Moreover, the coherent domain size of tin particles in this case is almost the same as for the materials obtained by thermal vacuum deposition. Besides, it is necessary to... [Pg.365]

New techniques are being applied to develop miniaturized sensor arrays such as screen printing for thick film and electron beam evaporation, thermal vacuum deposition, and pulsed laser deposition for thin-film technique. Microfabrication techniques were used to prepare a sensor array for use in a voltammetric e-tongue by depositing gold (Au), platinum (Pt), iridium (Ir), and rhodium (Rh) on a silicon wafer. [Pg.435]

See other pages where Thermal vacuum deposition is mentioned: [Pg.361]    [Pg.363]    [Pg.366]    [Pg.367]    [Pg.349]    [Pg.351]    [Pg.354]    [Pg.355]    [Pg.349]    [Pg.351]    [Pg.354]    [Pg.355]    [Pg.553]    [Pg.29]    [Pg.110]   
See also in sourсe #XX -- [ Pg.349 ]

See also in sourсe #XX -- [ Pg.349 ]

See also in sourсe #XX -- [ Pg.349 ]



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Vacuum deposition

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