Underfill adhesives thermal conductivity

Properties of nanofillers recently developed nano materials are reported to display greater mechanical strength, greater thermal conductivity and improved electrical performance when compared to materials of normal particle sizes. Nano dimensional materials are being studied as fillers in polymer matrices in a variety of formulations for electrically conductive adhesives, thermally conductive adhesives, encapsulants, printed circuit boards, coatings, catalysts, underfills for flip-chip-attached devices and wafer-level connections. ... 

Figure 5.22 shows a specimen process flow for flip-chip gluing with ICA. Conductive adhesive is stenciled on to the substrates. The devices are then placed on the chip, and the conductive adhesive is thermally cured. As in flip-chip soldering, underfill Is applied as mechanical protection and cured. 

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