Thermal Analysis and Measurement of Oxidation Stability

Relating to Thermal Analysis is an umbrella term for various analytical methods, such as thermogravimetry (TGA) described briefly in Sect. 3.2.3. An overview of the methods of thermal analysis is given in (Hemminger and Cammenga 1989). 

A DSC apparatus consists in principle of two ovens. In one of the ovens a crucible filled with the specimen is installed, and an empty crucible as a reference specimen is placed in the other oven. The ovens are located in a specified gas atmosphere. Both ovens are heated, cooled or annealed at a constant temperature according to a controlled temperature programme. The difference in the heat flow of the two ovens, which is necessary to carry out the temperature programme, is measured as a function of time or oven temperature (thermal curve). 

Material Glass transition temperature (°C) Melting temperature (°C) Temperature of thermal decomposition (°C) 

Occasionally, the oxidative induction temperature (also abbreviated as OIT) is also measured. The specimen is exposed to an oxygen atmosphere from the start, heated at a constant rate and the heat flow difference meas- 

1 Isothermal gas pre-purge Initial cell temperature continuous N2 gas flow (30 ml/min) duration about 1 min 

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