The electronics industry found alternatives to BFRs

As concern around bromine compounds grew, industry moved away from those underthe greatest legislative pressure (PBDEs and PBBs) towards other bromine compounds such asTBBP-Aand HBCD. Meanwhile, understanding of the toxicity and persistence of TBBP-A and HBCD has increased the pressure to address brominated flame retardants as a 

Apple does not use brominated flame retardants in the enclosure plastics for its products.  

a brominated flame retardant, is used in the epoxy resin laminate in printed circuit boards in most manufacturers products. In 1997, a phosphorus-based alternative to TBBA was developed by the German engineering giant, Siemens, 

In 2000, NEC developed an epoxy resin with what it describes as a fire-retardant structure that avoids the need for either TBBA or phosphorus-based flame retardants in circuit boards. The new resin contains a metal hydroxide retardant. The company claims the new board is almost totally free of pollutants, and is easy to process and thermally recycle. By also integrating flame retardant properties within the board, use of the metal hydroxide is minimised, while offering good electrical properties, higher heat resistance and improved processing characteristics.  

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