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Temperature effects water expansion

Backwashing - After exhaustion, the bed is backwashed to effect a 50 percent minimum bed expansion to release any trapped air from the air pockets, minimize the compacmess of the bed, reclassify the resin particles, and purge the bed of any suspended insoluble material. Backwashing is normally carried out at 5-6 gpm/ft. However, the backwash flow rates are directly proportional to the temperature of water. [Pg.392]

Thermal Expansion. Most manufacturers literature (87,119,136—138) quotes a linear expansion coefficient within the 0—300°C range of 5.4 x 10"7 to 5.6 x 10 7 /°C. The effect of thermal history on low temperature expansion of Homosil (Heraeus Schott Quarzschmelze GmbH) and Osram s vitreous silicas is shown in Figure 4. The 1000, 1300, and 1720°C curves are for samples that were held at these temperatures until equilibrium density was achieved and then quenched in water. The effect of temperature on linear expansion of vitreous silica is compared with that of typical soda—lime and borosilicate glasses in Figure 5. The low thermal expansion of vitreous silica is the main reason that it has a high thermal shock resistance compared to other glasses. [Pg.505]

A solid body at initial temperature To is immersed in a bath of water at initial temperature Tui . Heat is transferred from the solid to the water at a rate Q = K. (T, — T), where E is a constant and T and T are instantaneous values of the temperahires of the water and solid. Develop an expressionfor T as a function of time t. Check your result for the limiting cases, t = 0 and t = 00. Ignore effects of expansion or contraction, and assume constant specific heats for both water and solid. [Pg.54]

Viscoelasticity Time-temperature effects under dynamic/cyclic loading Specific heat, thermal conductivity and thermal expansion Optical properties Chemical resistance Water absorption Important process design parameters Colour, reflectance and opacity Resistance to chemical reactions during and after processing Measures material-solvent interaction... [Pg.209]

A.212. This section should describe the design bases for qualification of components to resist such environmental factors as vibration, thermal expansion, radiation, corrosion, dynamic effects, mechanical loadings and high pressure, high temperature, humidity, water, steam, chemicals, low temperature or vacuum. Qualification tests and analyses that have (or will be) performed should be described. [Pg.28]

For nonionic surfactants of the ethylene oxide type, the temperature effect is opposite to that of ionic surfactants, because of the peculiar temperature dependence of the hydration of ethylene oxide groups. As the temperature increases, the ethylene oxide chain loses its hydration water and the spontaneous curvature decreases. To a good approximation, the spontaneous curvature can be approximated by the first term of expansion in series versus temperature "... [Pg.213]

Physical characteristics Molecular weight Vapour density Specific gravity Melting point Boiling point Solubility/miscibility with water Viscosity Particle size size distribution Eoaming/emulsification characteristics Critical temperature/pressure Expansion coefficient Surface tension Joule-Thompson effect Caking properties... [Pg.4]


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