Teflon substrate

Maroulis and Bandy ( ) determined DMS in air at Wallops Island by cryotrapping air drawn through a teflon tube packed with glass beads immersed in liquid argon. The DMS was thermally desorbed onto a GC column with polyphenyl ether/H PC liquid phase coated onto a teflon substrate and was detected via doped "FPD. No mention was made in that paper of sampling losses, however it has been suggested that the presence of the glass beads may have served to remove co-trapped oxidants (D. Thornton, personal communication). 

Figure 13. Transmission electron micrographs of plasma-polymerized ethylene on Teflon substrate. Polymerization conditions are the same as in Figure 12 ( 46j.

The elastomer is removed from the KBr solution by floating it off onto a piece of Teflon sheet. Wash the elastomer twice in distilled water (20 ml) to remove any residual KBr and carefully pat dry with filter paper whilst on the Teflon substrate. 

Selective Deposition of Copper onto Laser-Patterned, Etched Teflon Substrates... 

Figure 2. Peet strengths of Cu strips deposited on textured Teflon substrates by Ar>ion sputtering prior to the Cu deposition.

Figure 4. Peel strengths of Cu and Cu(90%)Cr(l0%) deposited on AI2O3 films of different thicknesses. The AljOj films were deposited on textured Teflon substrates as described in the text.

Two-dimensional FTIR spectroscopy was used to study the N-H stretching and amide I/amide II region of melt-crystallised nylon 11 thin films on Teflon substrates. The samples were dynamic mechanically oscillated at room temp, at a frequency of 11 Hz. A two-dimensional correlation analysis on the dynamic spectra indicated that the N-H stretching region split into two peaks. Analysis... 

Miller, T. L., Teflon substrates for microwave circuitry. Circuits Manuf., (May 1984) 73-5. 

Recently, a modified decal transfer technique for CCM fabrication was reported [55]. In this method, a colloidal catalyst ink was used, as described by Uchida [56]. First, the ink was coated onto a Teflon substrate. After drying, the CL was transferred to a H" " form membrane (e.g. Nafion 112 membrane) by hot pressing at 120-135 °C. Finally, the Teflon substrate was peeled off the CCM. 

Sihlbom et al. (Ref 43) studied experimentally the high-frequency performance of a silicon flip-chip bonded on a Teflon substrate using ACA. However, due to the large variation of individual joints, the experimental study could not give a detailed picture on RF performance of an ACA joint. To elucidate the effects of conductive particles, a 3D finite difference in time domain (FDTD) modeling of the ACA flip-chip discontinuities has been performed (Ref 44). 

Now let us try to make a water layer on a Teflon surface. We will be unable to do this, exactly in the same way as we were unable to in the case of mercury on a glass surface. That is, the same aqueous droplet can spread out partially on a glass substrate and does not spread at all on a Teflon substrate. The inability to spread on the Teflon surface indicates that the wetting or nonwetting is not a property of the liquid but rather a property of the liquid-solid pair. 

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