Tantalum coating techniques

Cardarelli, F. Taxil, P. Savall, A. (1996) Tantalum protective thin coating techniques for the chemical process industry molten salts electrocoating as a new alternative. Int. J. Refract. Metals Hard Mater.,14, 365-881. 

Cardarelli F., Taxil P. and Savall A., (1996), Tantalum Protective Coating Techniques for the Chemical Process Industry, Int. J. of Refractory Metals and Hard Materials, 14, 365-381. 

All experiments were performed on 200mm wafers using Semitool s plating tool. Trenches with various geometries and aspect-ratios were patterned in silicon oxide coated wafers. Titanium Nitride (TiN) or Tantalum (Ta) diffusion barriers with nominal thickness of 300 A were deposited on the trenches by vacuum techniques such as PVD or CVD. Unless specified differently, a PVD copper adhesion layer with a nominal thickness of 200A was deposited on top of the barrier by PVD techniques. This thin PVD copper adhesion layer was electrochemically enhanced in Semitool s proprietary ECD seed plating solution prior to the full deposition from an acid copper sulfate bath. 

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