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Surface of copper

Figure 9 shows the majority Fermi surfaces of copper and cobalt. It is clear from Figure 9 that for some large values of k there are allowed values of kj in the copper but not in the cobalt. For tlie minority channel, however, there is always an allowed value of kj in the cobalt if there is an allowed value in the copper. This means that some of the majority electrons with large values of ky will be confined within the copper when the spins are aligned. They will undergo total internal reflection at the copper-cobalt interface. [Pg.273]

The electrode potential behaviour of copper in various solutions has been investigated and discussed in considerable detail by Catty and Spooner . According to these workers a large part of the surface of copper electrodes in aerated aqueous solutions is normally covered with a film of cuprous oxide and the electrode potential is usually close to the potential of these film-covered areas. The filmed metal simulates a reversible oxygen electrode at... [Pg.686]

Electroless nickel deposition may then be carried out directly onto steel, aluminium, nickel or cobalt surfaces. Surfaces of copper, brass, bronze, chromium or titanium are not catalytic for deposition of nickel-phosphorus and the reaction must be initiated by one of the following operations ... [Pg.537]

Currently, there is a trend of low dielectric constant (low-k) interlevel dielectrics materials to replace Si02 for better mechanical character, thermal stability, and thermal conductivity [37,63,64]. The lower the k value is, the softer the material is, and therefore, there will be a big difference between the elastic modulus of metal and that of the low-k material. The dehiscence between the surfaces of copper and low-k material, the deformation and the rupture of copper wire will take place during CMP as shown in Fig. 28 [65]. [Pg.250]

A reaction of solid copper with oxygenated atmosphere to form an oxide layer on the surface of copper is shown below ... [Pg.297]

FIGURE 40 Patina. Patina is a colored (usually green) layer of corrosion products that frequently develops naturally on the surface of copper and copper alloys exposed to the environment. Since it is sometimes appreciated aesthetically and as a proof of age, patina is also developed artificially, by chemical means, as a simulated product of aging. Copper patina generally includes such compounds as copper oxides, carbonates, and chlorides. In bronze and brass patinas, these compounds are mixed with the oxides of tin and lead resulting from the corrosion of the other components of the alloys. In any particular patina there may be many layers, not necessarily in the order shown in the illustration. [Pg.219]

Copper is a metallic element brass is an alloy or mixture of the metallic elements copper and zinc. The surfaces of copper and brass items tarnish with prolonged exposure to air, particularly in moist environments with high carbon dioxide (CO2) or sulfur dioxide (SO2) concentrations (see color Fig. 5.2.1). The compounds that form on the surface, ranging in color from black to blue to dark green, dissolve readily in acidic solutions. Vinegar contains acetic acid, ketchup contains tomatoes rich in ascorbic acid (Vitamin C), and onions contain malic acid and citric acid. All of these foods provide variable amounts of acid to dissolve the tarnish on copper surfaces. [Pg.37]

Cruz M, Kaiser A, Rowxhat PG, et al. 1974. Absorption and transformation of HCN on the surface of copper and calcium montmorillonite. Clays Clay Mineral 22 417-425. [Pg.243]

Here, the dissociative adsorption of hydroi l radicals increases with increasing coadsorption of electropositive potassium atoms on the platinum surface. It has also been reported that coadsorption of electronegative oxygen molecules accelerates the adsorption of hydroxjd radicals on the surface of copper, silver and nickel [Thiel-Madey, 1987]. [Pg.162]

Again Constable and Palmer have investigated the rate of decomposition of a number of primary alcohols into aldehydes and hydrogen at the surface of copper. In this case it is only the terminal —CHaOH group which undergoes decomposition. It was found that the temperature coeflScient for the rates of decomposition of all the alcohols was identical (1 540), supporting the hypothesis... [Pg.154]

The Cd UPD behavior on Cu(llO) was found similar to that for Cu(lll), with more pronounced alloying, resulting in irreversible changes of the original (110) surface of copper [295]. [Pg.788]

PATINA. Variously used to refer to an ornamental andA>r corrosion-resisting film on the surface of copper, copper alloys, including bronzes, and also sometimes iron and other metals. Such a film is formed by exposure to the air or by a suitable chemical treatment. [Pg.1219]

Certain catalytic reactions, such as the reaction of hydrogen and oxygen on the surface of copper, produced marked rearrangements of the surface to expose facets parallel to certain crystal planes. The surface of such a catalyst appeared to be extremely mobile at temperatures as low as 325°. [Pg.83]

Halley et al. employed a MD method for the simulation of metal/water interfaces.72 They found that the occupancy of on-top binding sites for water in this model as applied to a (1 0 0) surface of copper was very sensitive to potential. They suggested that this may provide an explanation for some previously unexplained features of X-ray data on water structure and noble metal/water interfaces. They also noticed that the strong bonding of water on a metal surface may result in metastable charging of the interface in molecular dynamics timescales. [Pg.334]

Yoshida et alP2 observed that oxygen within a layer of 20 A thickness of the surface of copper vanadate catalysts takes part both in reduction by CO and in CO oxidation. The Cu ions are also very mobile in this layer and surface enrichment of these ions occurs upon 02 treatment after reduction at 200°C. [Pg.112]

The reaction of dimethyldichlorosilane disproportioning under the influence of aluminum chlorides sharply accelerates on the surface of copper in the presence of methylchloride. In this connection, the process of direct synthesis can encounter the conditions in which the formation of trimethylchlorosilane due to dimethyldichlorosilane disproportioning occurs at noticeable speed, and the quantity of trimethylchlorosilane in the mixture formed can be increased to 20%. At the same time, another reaction accelerates on the surface of copper reacting with methylchloride, the methylation of dimethyldichlorosilane with methylchloride in the presence of aluminum or zinc ... [Pg.32]

The preparation of well-defined single-crystal surfaces of copper oxides in UHV or of well-sintered powders, starting from polycrystalline materials, is difficult. Consequently, structure-catalytic property correlations remain to be established. [Pg.337]

Another example of an adsorption study employing the SECM was reported by Mansikkamaki et al. [148]. They investigated the adsorption of benzothia-zole (a passivating agent for the oxidation of copper) on the surface of copper alloys using the steady-state feedback approach. [Pg.227]

Compared to the oxidic surfaces of copper and zinc, the adsorption process of PVFA-co-PVAm onto Fe and Fe203 powders was weakly dependent on the composition of the polymer. The results are given in Table 7. [Pg.115]

No more complete study of a single catalysed reaction has ever been published than that of Palmer and Constable,2 extending over eight years, on the dehydrogenation of alcohols by heated copper surfaces. Aldehydes are formed from primary and ketones from secondary alcohols by this reaction. The work has resulted in a considerable increase in our knowledge of the mode of formation and properties of the active centres on the surface of copper, and much of it may be applicable also to other metallic catalysts. The reactions are... [Pg.285]

As has been mentioned in 1, smooth surfaces of copper, including those deposited electrolytically, reduced copper mirrors, and polished surfaces were quite inactive (a, i) a minute trace of activity only was occasionally detected in commercial copper gauze, but copper prepared by thermal decomposition of either cupric or cuprous oxides, or copper salts of mono- and dibasic fatty acids, by condensation on china-clay rods2 from the vapour (in nitrogen, to prevent oxidation), or by stirring up the atoms of copper into open formation by heating in ammonia at 820°, was active (t). [Pg.285]

Finally, the behaviour of the unsaturated allyl alcohol, which can undergo two reactions on the surface of copper, was studied (j). It can be... [Pg.287]

Fio. 32. Differential heats of adsorption for nitrogen on the oxidized (110), (100), and (111) single crystal faces and the polycrystalline surface of copper calculated from the adsorption isotherms by the author at 78.1-83.5, 78.1-89.2 and 83.5-89.2°K. The heat-coverage curve for nitrogen adsorption on polycrystalline chromic oxide at 90°K. has been calculated from the calorimetric and adsorption data of Beebe and Dowden. The experimental errors are indicated as in Fig. 31. [After Rhodin, J. Am. Chem. Soc. 72, 5641 (1950).]... [Pg.104]

Section II of this paper contains a description of the mechanism of NEXAFS spectroscopy, experimental setup and the types of information that can be obtained. Section III presents examples of work by others which serve as an important basis for the interpretation of our studies, and also several experiments on oriented polymer films and Langmuir-Blodgett films. Section IV describes a study of the chemical interaction that takes place when chromium metal is evaporated onto spun polymers, including polyimide. Section V describes the results of a study of poly(amic acid) films grown by epitaxy on clean surfaces of copper and chromium, and the effect of annealing to induce imidization. [Pg.37]

The adsorption mode of acetylene on the (111) surfaces of copper has already been unequivocally determined both by experimental [6,7,13] and theoretical techniques... [Pg.220]


See other pages where Surface of copper is mentioned: [Pg.195]    [Pg.273]    [Pg.26]    [Pg.139]    [Pg.214]    [Pg.218]    [Pg.511]    [Pg.115]    [Pg.145]    [Pg.189]    [Pg.193]    [Pg.194]    [Pg.486]    [Pg.241]    [Pg.261]    [Pg.544]    [Pg.72]    [Pg.65]    [Pg.224]    [Pg.72]    [Pg.100]    [Pg.107]    [Pg.111]    [Pg.165]    [Pg.346]    [Pg.60]   
See also in sourсe #XX -- [ Pg.204 ]




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