Surface finishes Kirkendall voids

Package and PWB surface finish Black Pad, Brittle Failure, and Kirkendall voiding... [Pg.1366]

The occurrence of Kirkendall voids is not limited to the package/solder joint interface. If OSP is used as the PWB surface finish, the same phenomenon is observed to occur on the PWB side. ... [Pg.1386]

This chapter reviews Uteratme on the microstructure of solder joints and the interactions of solders with substrates and related solder joint reliability issues. The substrates here are limited to Cu, Ni-coated Cu, electroless nickel/ immersion gold (ENIG), and hot air solder leveled (HASL) Sn-Pb. The solders are mainly Sn, eutectic or near eutectic Sn-Ag, and Sn-Ag-Cu alloys. Specific reliability issues discussed here include black pads of ENIG, gold embrittlement, compatibility of Pb-free solders with Pb-containing surface finish, and Kirkendall voids. [Pg.29]

Work is also needed to further characterize the creep and fatigue behavior of the lead-free solder alloy. The interfacial interactions (including intermetallics formation and growth, and the formation of Kirkendall voids on various PWB surface finishes) and their impact on reliability also warrant further investigation (Ref 2-3). [Pg.277]

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