Superconformal film growth

Thomas P. Moffat, Daniel Wheeler, and Daniel Josell 

In this chapter we will discuss some recent developments in this field as of 2004. Particular emphasis is given to quantitative studies of the connection between electrochemical kinetics and morphological evolution. No attempt has been made to review all of the relevant literature comprehensively, but rather our intent is to highlight a selection of exciting results that deal primarily with the filling of micro-and nanometer scale features. 

Edited by Richard C. Alkire, Dieter M. Kolb, Jacek Lipkowski and Philip N. Ross Copyright 2008 WILEY-VCH Verlag GmbH Co. KGaA, Weinheim ISBN 978-3-527-31317-6 

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The correlation between the electrochemical transients observed on planar electrodes and superconformal film growth in sub-micrometer features indicates that the electrochemical metrics can be used for rapid screening of potential superfilling electrolytes. A more detailed and focused discussion of measurements and modeling of the SPS-PEG-C1 additive system for copper plating follows with the notion that the approach used is directly applicable to many other systems. 

Moffat TP, Wheeler D, Edelstein MD, Josell D (2005) Superconformal film growth mechanism and quantification. IBM J Res Dev 49 19-36... 

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