Succinic anhydride treatment adhesion

Gopalan Nair et ehemieally modified the chitin whiskers by using different coupling agents, namely phenyl isocyanate (PI), alkenyl succinic anhydride (ASA) and 3-isopropenyl-R, R -dimethylbenzyl isocyanate (TMI). These various chemieal treatments on chitin whiskers improve the adhesion between the chemically modified ehitin whiskers and the NR matrix. However, the mechanical performances of these NR composites markedly decrease after chemical modification. This is due to the partial or total destruction of the three-dimensional network of ehitin whiskers, which is assumed for the unmodified composites. 

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