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Substrates interdiffusion with

Silver coatings may blister above 200°C because of oxygen diffusion. A nickel undercoat stops interdiffusion with a copper substrate above 150°C. Alloying with antimony, selenium, sulphur or rhenium increases hardness—the coefficient of friction is also much reduced in the last case. ... [Pg.565]

The degradation modes of coatings are essentially the same as those described for cyclic oxidation of alloys in Chapter 5, mixed-oxidant corrosion of alloys in Chapter 7, and hot corrosion of alloys in Chapter 8. However, additional factors arise with coatings since they are relatively thin, they contain a finite reservoir of the scale-forming elements (Al, Cr, Si), and interdiffusion with the substrate can both deplete the scale-forming element and introduce other elements into the coating. Additional mechanical affects also arise, which can lead to deformation of the coating. Mechanical effects are also critical to the durability of TBCs. [Pg.289]

A1 based alloys containing small amounts of Si to reduce interdiffusion with the substrate and Cu to strengthen the metal and limit electromigration were used in the past as... [Pg.827]

An inversion of these arguments indicates that release agents should exhibit several of the following features (/) act as a barrier to mechanical interlocking (2) prevent interdiffusion (J) exhibit poor adsorption and lack of reaction with at least one material at the interface (4) have low surface tension, resulting in poor wettabihty, ie, negative spreading coefficient, of the release substrate by the adhesive (5) low thermodynamic work of adhesion ... [Pg.100]

With tin coatings on brass, the interdiffusion of coating and substrate brings zinc to the surface of the tin the action can be rapid even with electrodeposited coatings. The effect of zinc in the surface layers is to reduce the resistance of the coating to dulling in humid atmospheres, and the layer of zinc corrosion product formed makes soldering more difficult. An intermediate layer of copper or nickel between brass and tin restrains this interdiffusion . [Pg.507]


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See also in sourсe #XX -- [ Pg.12 , Pg.40 ]

See also in sourсe #XX -- [ Pg.12 , Pg.40 ]




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Interdiffusion substrates

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