Structure and Properties on the Polishing Process

The expected impact of the material properties reviewed in Table II on the polishing mechanisms reviewed in the previous section is summarized in Table IV. As might be expected from previous discussion on structure vs properties, a high degree of interaction between properties and process effects is evident. Publicly available evidence to support materials properties effects on the CMP process is relatively limited. This is reviewed in Section IV. 

Summary of Expected Pad Material Property Effects on the CMP Process 

Material property Impact on polishing mechanism CMP process impact 

Pad texture (e.g., grooving) Thickness of lubrication film Rate nonuniformity 

Hardness (asperity) Contact pressure Roughness defectivity 

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