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Stress distribution: bond thickness

Other relevant articles include Stress distribution bond thickness. Stress distribution Poisson s ratio. Stress distribution stress singularities. Stress distribution shear lag solution and Stress distribution mode of failure. [Pg.493]

Second, around the periphery of the joint, both tensile and shear stresses act (see Stress distribution bond thickness). As Fig. 2 shows, their magnitude depends on the aspect ratio of the joint and also varies throughout the thickness of the adhesive layer. On the adhesive - substrate interface, there is always a stress concentration at the edge of the substrate. [Pg.530]

Stress distribution bond thickness D A DILLARD Adhesive thickness and fracture energy... [Pg.659]

The design analysis of a scarf may be considered similar to a single lap bonded joint, detailed analysis of which can be found in MIL-HDBK 17-3E 3. The analysis of a bonded joint is made complex, however, by the modulus difference of the adhesive compared to the adherends and the relative thicknesses of both which causes a non-linear distribution of the shear forces in a lap joint with peak stresses at the ends [1]. Scarf repairs provide a more uniform stress distribution however, to achieve this an adequate scarf angle is required [24] shown in Eigure 14.6. [Pg.407]

Volkersen s theory predicts that the shear stresses in the adhesive layer reach a maximum at each end of the overlap, when the bonded plates are in pure tension. Photoelastic analyses of these composite structures show that stresses are uniform in the central part of the model adhesive, but high near the edges of the steel plate used in the analysis (Figure 7.2). Stress distributions at the end were found to be independent of the length of the overlap, when its length was at least three times the thickness of the adhesive layer. " ... [Pg.180]

Shear tests are very common because samples are simple to construct and closely dupUcate the geometry and service conditions for many structural adhesives. As with tensile tests, the stress distribution is not uniform and, while it is often conventional to give the failure shear stress as the load divided by the bonding area (Table 11.1), the maximum stress at the bond line may be considerably higher than the average stress. The stress in the adhesive may also differ from pure shear. Depending on such factors as adhesive thickness and adherend stiffness, the failure of the adhesive shear joint can be dominated by either shear or tensioa ... [Pg.274]

In case of bonded composite joints, the non-uniform stress distribution along the bonding surface should always be accounted for. The peak stress is mainly dependent on the bonding pattern of the joint, adhesive thickness, bonded length, joint geometry, adherend stiffness imbalance, ductile adhesive response, and the composite adherends. [Pg.95]

Keywords Adhesive modulus Adhesys expert system Co-axial joints Compression Concealed joints Creep Elastic limit Epoxy Epoxy composite Einite element analysis Glue line thickness Goland and Reissner Hart-Smith Heat exchanger Hooke s Law Joint designs Joint thickness Lap shear strength Peel Plastic behaviour Polyurethane Pipe bonding Shear stresses Shear modulus Stress distribution Thick adherend shear test Tubular joints Volkersen equation Young s modulus... [Pg.198]

Structural glazing Surface preparations Teak decks Test of a bead Thickness of the joint Transport equipment Uneven stress distribution UV radiation Waterswelling sealants Wettability Windshield bonding Woehler diagram. [Pg.356]

In general, residual stress refers to the internal stress distribution present in a material system when all external boundaries of the system are free of applied traction. Virtually any thin film bonded to a substrate or any individual lamina within a multilayer material supports some state of residual stress over a size scale on the order of its thickness. The presence of residual stress implies that, if the film would be reheved of the constraint of the substrate or an individual lamina would be relieved of the constraint of its neighboring layers, it would change its in-plane dimensions and/or would become curved. If the internal distribution of mismatch strain is incompatible with a stress-free state, then some residual stress distribution will remain even under these conditions. [Pg.65]

Since the stress distribution across the bonded area is not uniform and depends on joint geometry, the failure load of one specimen cannot be used to predict the failure load of another specimen with different joint geometry. The results of a particular shear test pertain only to joints that are exact duplicates. To characterize overlap joints more closely, the ratio of overlap length to adherend thickness l/t can be plotted against shear strength. A set of l/t curves for aluminum bonded with a nitrile-rubber adhesive is shown in Fig. 7.11. [Pg.412]

The bonded joints between typical thin structural elements have an extensive capability to tolerate the load redistribution that is caused by local flaws and porosity with no loss whatever in strength or durability. This derives from the same minimum overlaps needed to provide resistance to creep rupture that were discussed earlier. Figs. 26-29, taken from ref. [19], address this issue in the context of the longitudinal skin splices in the PABST forward fuselage, where the thickness was 0.050 inch of 2024-T3 aluminum alloy. Fig. 27 shows the adhesive stress distribution at room temperature for a load of 1000 Ibs./in., which corresponds with a 1.3 x P proof pressure load. Significantly, this load does not even exceed the elastic capability of the adhesive for this environment. [Pg.759]

Figure 50 Stress distribution over the half-length of 1 cm dice bonded to ceramic substrate. Curves (a) and (a represent the maximum shearing stress in the attachment for 25 and 100 xm IP 670 adhesive layer, while curves (b) and (b show the maximum normal stress in the die for the same thicknesses. Figure 50 Stress distribution over the half-length of 1 cm dice bonded to ceramic substrate. Curves (a) and (a represent the maximum shearing stress in the attachment for 25 and 100 xm IP 670 adhesive layer, while curves (b) and (b show the maximum normal stress in the die for the same thicknesses.

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