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Solvent-Free C-0 Bond Formation

Solvent-Free C-0 Bond Formation under Photoirradiation... [Pg.309]

Type of reaction C-0 bond formation Reaction condition solvent-free... [Pg.312]

Other Metal Catalysts Palladium catalysts are most widely used for C—N bond formation, particularly in Buchwald-Hartwig coupling reactions [48], Halides or pseudohalides are generally used. Recently, direct aminationof C— H bonds has been developed with palladium catalysts. Pd(0)-catalyzed diamination of terminal olefins at allylic and homoallylic carbons takes place via formal sp3 C—H activation under solvent-free conditions [49]. More recently, an asymmetric version of allylic and homoallylic diamination has been successfully achieved using di-tert-butyldiaziridi-none as the nitrogen source (Equation 11.21) [50]. [Pg.345]


See other pages where Solvent-Free C-0 Bond Formation is mentioned: [Pg.305]    [Pg.279]    [Pg.283]    [Pg.287]    [Pg.305]    [Pg.279]    [Pg.283]    [Pg.287]    [Pg.141]    [Pg.306]    [Pg.78]    [Pg.71]   


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Free formation

SOLVENT BONDING

Solvent-Free C-0 Bond Formation under Photoirradiation

Solvent-Free C-N Bond Formation

Solvent-Free C-N Bond Formation under Microwave Irradiation

Solvent-Free C-O Bond Formation

Solvent-Free C-O Bond Formation under Microwave Irradiation

Solvent-Free C-P Bond Formation

Solvent-Free C-P Bond Formation under Microwave Irradiation

Solvent-Free C-S Bond Formation

Solvent-Free C-S Bond Formation under Microwave Irradiation

Solvent-Free C-X Bond Formation

Solvent-free

Solvent-free C-O bond formation, under

Solvent-free C-O bond formation, under photoirradiation

Solvent-free bond formation

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