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Solder replacement adhesives

Table 5.7 Compatibility of various solder replacement adhesives with surfaces and printing resolutions... Table 5.7 Compatibility of various solder replacement adhesives with surfaces and printing resolutions...
The unstable behavior of some solder-replacement adhesives has been attributed to galvanic corrosion. Similar to most corrosion mechanisms, condensed or absorbed moisture on the surface and dissimilar metals are required to form a galvanic cell. The silver filler acts as a cathode while the substrate metallization acts as an anode and is oxidized. In the case of tin-lead solder surfaces, the solder, which has a lower electrochemical potential (0.13 V) than silver (0.79 V), becomes the anode at which corrosion and oxidation occur. A smaller potential difference between a copper surface and silver accounts for some improvement in contact resistance over the solder-silver couple. [Pg.312]

To minimize the corrosion reactions, oxygen scavengers and corrosion inhibitors may be used as additives in solder-replacement adhesives. The percent changes in... [Pg.312]

Table 6.3 Behavior of solder-replacement adhesives on non-noble metal surfaces ... [Pg.313]

Table 5.7. Compatability of Various Solder Replacement Adhesives with Surfaces and Printing Resolutions... Table 5.7. Compatability of Various Solder Replacement Adhesives with Surfaces and Printing Resolutions...
Table 6.2. Behavior of Solder Replacement Adhesives on Non-noble Metal Surfaces l... [Pg.365]

See other pages where Solder replacement adhesives is mentioned: [Pg.180]    [Pg.241]    [Pg.242]    [Pg.302]    [Pg.302]    [Pg.364]    [Pg.219]    [Pg.304]    [Pg.304]    [Pg.366]    [Pg.528]   
See also in sourсe #XX -- [ Pg.4 , Pg.11 , Pg.243 ]



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