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Single-Ended Analog Architecture

The singled-ended analog architecture comprises a temperature sensor on the bulk chip, three single-ended analog proportional microhotplate temperature controllers [Pg.87]

A micrograph of the single-ended hotplate-based microsystem is shown in Fig. 6.2 and features a die size of 5.0 x 2.9 mm. This system is a minimal implementation of a temperature-controlled microhotplate system. Temperature modulation is facilitated by an direct access to the input voltage A modulation of the input voltage is translated into a modulation of the microhotplate temperature. Another interesting application of the system includes its use as a microcalorimeter or as a material research platform [145]. The schematic of the temperature-control loop is shown in Fig. 6.3. [Pg.88]

The temperature sensor is located in the microhotplate center (J2x, 10 kO nominal). This polysilicon resistor is biased with a temperature-independent current source (/bias)- The voltage-drop across the polysilicon temperature sensor provides the feedback signal for the temperature controller. [Pg.89]

The dominant pole of this temperature control system is determined by the thermal time constant of the microhotplate, which is approximately 20 ms. The open-loop gain of the single-ended analog architecture (Aol seaa) i given by Eq. (6.1)  [Pg.89]

The performance of the single-ended analog proportional temperature controller in the tracking mode is shown in Fig. 6.4. The measurement was done at room temperature, and the control voltage of microhotplate 1 was increased in steps of 100 mV. For example, a control voltage of 1.60 V produced a microhotplate temperature of approximately 355 °C. Microhotplate 2 was kept at a constant temperature of 200 °C and microhotplate 3 was kept at 350 °C. [Pg.90]


Fig. 6.1. Block diagram of the single-ended analog architecture... Fig. 6.1. Block diagram of the single-ended analog architecture...
Fig. 6.6. Discrepancy between ambient temperature and bulk-chip temperature as a function of the microhotplate temperature for the single-ended analog architecture (DIE package)... Fig. 6.6. Discrepancy between ambient temperature and bulk-chip temperature as a function of the microhotplate temperature for the single-ended analog architecture (DIE package)...

See other pages where Single-Ended Analog Architecture is mentioned: [Pg.87]    [Pg.87]    [Pg.88]    [Pg.89]    [Pg.91]    [Pg.87]    [Pg.87]    [Pg.88]    [Pg.89]    [Pg.91]    [Pg.110]    [Pg.1940]    [Pg.188]    [Pg.153]    [Pg.190]   


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