Silicon, structuring technology

Figure 3. Cross section of the two basic geometries for microresonators with port waveguides (a) vertical arrangement (h) lateral arrangement (the dashed region indicates the analyte layer). The structure in this case is fabricated in silicon-based technology, with the index of refraction of Si02 and Si3N4 1.45 and 2.0 respectively.

Acidic silicon etchants are mainly used for two purposes for the delineation of crystal defects, as discussed in Section 2.5, or to remove silicon in an isotropic manner. Isotropic etching adds another degree of freedom to the design of micromechanical structures, because all alkaline etches are anisotropic. Most isotropic etchants for silicon were developed in the early days of silicon crystal technology and exhaustive reviews on this topic are available [Tu3, Rul]. A brief summary is given below. 

Offered constructively technological variant of a solid-state FC-element completely excluding clamping contacts (Fig. 2)[3]. The design of a FC-element provides presence of all functional devices represented on Fig. 1. These elements are spatially allocated in volume of silicon structure. 

Porous silicon is compatible with standard silicon K-MOS technology and different microsystems based on this nanostructured material have been successfully fabricated [1], Porous silicon impregnating with solid state oxidants demonstrats combustion and explosion processes [2-5]. These processes can be used for various microactuators [6], In present work we have studied the influence of the porous silicon structure on the combustion and explosion processes. 

Silicon is by far the most important semiconductor for electronics and photovoltaics since the 1960s and for the foreseeable future. It is used in many forms, with monocrystalline and multicrystalline (MC) self-supporting silicon wafers being dominant but also in the forms of deposited thin-films in amorphous or crystalline form. The structure of one commercially important crystalline silicon cell technology is shown in Fig. 1. 

Fig. 1 Buried contact solar cell structure, an important wafer-based commercial silicon cell technology. Features include surface texturing for light trapping, diffusions front and rear and the front current grid buried in laser grooves. (Courtesy of UNSW Centre for Photovoltaic Engineering Image Library.)...

In a little more than 40 years silicone elastomers have emerged from laboratory curiosities to a broad family of synthetic, largely inorganic, materials useful In a wide variety of applications. Key discoveries in the development of silicone elastomer technology, including monomer synthesis and polymerization, crossllnking and reinforcement of the polymers, will be reviewed. Composition and structural features responsible for the characteristic properties of these versatile elastomers will be discussed and related to their applications. 

Silicon has a diamond cubic crystal structure. The Miller indices of the main crystallographic planes of silicon are (100), (110) and (111), respectively. In the wet bulk-micromachining, there are two silicon etching methods isotropic (direction-independent) and anisotropic (direction-dependent) etching. Wet chemical etching solutions are used in this bulk silicon micromachining technology. 

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