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Selective schematic sketch

Figure 4.18. Schematic sketching the experimental procedure used in 3D mesoscale self-assembly. Molding of a polyurethane prepolymer in a PDMS master generated polyhedra. Lubricant was added to the polyhedra in a water-filled Morton flask the use of liquid solder as a lubricant required the covering of selected faces with solder-coated copper tape. Axial rotation of the flask provided the agitation needed to cause collisions between liquid-coated pieces. The schematic depicts the formation and self-... Figure 4.18. Schematic sketching the experimental procedure used in 3D mesoscale self-assembly. Molding of a polyurethane prepolymer in a PDMS master generated polyhedra. Lubricant was added to the polyhedra in a water-filled Morton flask the use of liquid solder as a lubricant required the covering of selected faces with solder-coated copper tape. Axial rotation of the flask provided the agitation needed to cause collisions between liquid-coated pieces. The schematic depicts the formation and self-...
Figure 1.2 Schematic sketches of the four types of acoustic sensors discussed in detail in this book (a) Resonant quartz crystal like that used in electronic communications systems (after Lu [6]) (b) Suiface-acoustic-wave delay line with selective absorptive coating (after Wohltjen and Dessy [3]) (c) Acoustic-plate-mode delay line made from quartz crystal (after Ricco and Martin [7]) (d) Thin-membrane flexural-plate-wave delay line made by microfabrication techniques from a silicon wafer. Figure 1.2 Schematic sketches of the four types of acoustic sensors discussed in detail in this book (a) Resonant quartz crystal like that used in electronic communications systems (after Lu [6]) (b) Suiface-acoustic-wave delay line with selective absorptive coating (after Wohltjen and Dessy [3]) (c) Acoustic-plate-mode delay line made from quartz crystal (after Ricco and Martin [7]) (d) Thin-membrane flexural-plate-wave delay line made by microfabrication techniques from a silicon wafer.
Figure 2.9 Schematic sketch of the selective laser melting technology for metals. Figure 2.9 Schematic sketch of the selective laser melting technology for metals.
A schematic sketch of the sample deposition setup is shown in Fig. 3.12. After mass selection by means of the QMS (see Sect. 3.1.2) the clusters leave the QMS trough an exit lens attached to the QMS body. In an UHV chamber cross (2 x 10 mbar without deposition, 5 x 10 mbar during deposition) the cluster beam is then guided through aAfo shield (5) with an aperture of 9 mm (fixed on a grounded Cu feedthrough... [Pg.62]

Figure 22.6. PL spectra of a non-size-selected sample after different successive treatments after passivation in air for two months (thick solid curve), after exposure to HF vapor for 40 min (grey thin and dotted curves), after reexposure to air for 1 h (black thin and dashed curves), and after continued exposure to air for 2 d (dash-dotted curve). The sketch in the upper part of the figure illustrates the effect of the various treatments on the core and oxide shell of the nanoparticles (schematic). Figure 22.6. PL spectra of a non-size-selected sample after different successive treatments after passivation in air for two months (thick solid curve), after exposure to HF vapor for 40 min (grey thin and dotted curves), after reexposure to air for 1 h (black thin and dashed curves), and after continued exposure to air for 2 d (dash-dotted curve). The sketch in the upper part of the figure illustrates the effect of the various treatments on the core and oxide shell of the nanoparticles (schematic).

See other pages where Selective schematic sketch is mentioned: [Pg.183]    [Pg.352]    [Pg.55]    [Pg.352]    [Pg.76]    [Pg.63]    [Pg.63]    [Pg.593]    [Pg.261]    [Pg.333]   
See also in sourсe #XX -- [ Pg.42 ]




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