Sealants glass-ceramic seals

The E-design stack, shown in Fig. lA, consists of a relatively thick metallic interconnect with machined gas channels on both sides and a metallic picture frame for the cell, brazed to the interconnect by a metal solder. Sealing is obtained by glass ceramic sealants applied to the planar cell and frame surfaces using an automated dispenser. A fine Ni-mesh is spot-welded to the fuel side of the interconnect in order to improve the electrical contact between interconnect and anode substrate. On the air side usually a lanthanum cobaltite (LC) contact layer is sprayed onto the ribs of the interconnect. 

The most common sealants currently used in joining pSOFC cell assemblies and stacks are high-temperature glasses and glass-ceramics. These materials are typically designed to soften and flow at a temperature above that required for stack operation, then set to form a hermetic seal by chemically bonding with... 

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