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SAM-modified electrodes

SAMs controlling electrochemistry, whereas the reverse holds for the other one, both topics are inseparably intertwined as exemplified by the underpotential deposition of metal on SAM-modified electrodes where patterned SAMs allow localization of metal UPD, which in turn affects the monolayer. [Pg.199]

Given the tremendous development of SAMs over the past two decades it is dear that this chapter is able to cover only a fraction of the spectrum of topics related to the combination of SAMs and electrochemistry. For a comprehensive picture the reader is referred to a number of additional review articles, one of which is the excellent and extensive account of organized monolayers on electrodes by Finklea [23]. Besides this one, which comprehensively covers the literature up to the mid-1990s, other more focused reviews are available that address various developments over the past decade in areas of sensor development and electroanalytical applications [22, 24—28] and electrochemical metal deposition on SAM-modified electrodes [29, 30]. [Pg.199]

Figure 5.12 Possibilities to deposit metal onto a SAM-modified electrode, (a) intercalation of metal at the SAM/substrate interface, (b) deposition originating at the substrate with subsequent mushroom-like growth, (c) deposition on top of a SAM resulting in a metal-SAM-metal sandwich structure. Figure 5.12 Possibilities to deposit metal onto a SAM-modified electrode, (a) intercalation of metal at the SAM/substrate interface, (b) deposition originating at the substrate with subsequent mushroom-like growth, (c) deposition on top of a SAM resulting in a metal-SAM-metal sandwich structure.
Figure 5.17 Illustration of different pathways for growth of a U PD layer on a SAM-modified electrode, (a) Uniform penetration across the whole SAM area, (b) deposition starting at a major defect with subsequent penetration at edge ofUPD island (1), penetration through SAM across the whole U PD area due to the distortion of SAM structure by UPD (2) and growth of UPD island through initial defect only (3). Figure 5.17 Illustration of different pathways for growth of a U PD layer on a SAM-modified electrode, (a) Uniform penetration across the whole SAM area, (b) deposition starting at a major defect with subsequent penetration at edge ofUPD island (1), penetration through SAM across the whole U PD area due to the distortion of SAM structure by UPD (2) and growth of UPD island through initial defect only (3).
Another common feature of metal UPD on SAM-modified electrodes is the pronounced suppression of nucleation that for bare Au occurs at steps unless the step density is very low [218]. Even though nucleation still occurs mostly at steps for... [Pg.234]

In a SAM-modified electrode, the SAM functions as a dielectric, reducing the permeability of the monolayer by electrolyte and decreasing the charging current [23, 30, 48]. However, a thinner film [30, 49], one with a higher dielectric constant (e.g., containing unsaturated carbons [50]), or one which is more permeable to electrolyte (i.e., a more defective SAM), exhibits increased Cji because the resulting electrical double layer is better organized [23, 30, 48[. The double-layer capacitance is, thus, a convenient check of monolayer quality under the conditions of electrochemical electron-transfer measurements. [Pg.2922]


See other pages where SAM-modified electrodes is mentioned: [Pg.323]    [Pg.218]    [Pg.218]    [Pg.218]    [Pg.219]    [Pg.220]    [Pg.225]    [Pg.227]    [Pg.229]    [Pg.231]    [Pg.231]    [Pg.231]    [Pg.235]    [Pg.239]    [Pg.241]    [Pg.243]    [Pg.245]    [Pg.203]    [Pg.139]    [Pg.2933]    [Pg.11]    [Pg.110]    [Pg.218]    [Pg.218]    [Pg.218]    [Pg.219]    [Pg.220]    [Pg.221]    [Pg.223]    [Pg.225]    [Pg.227]    [Pg.229]    [Pg.231]    [Pg.231]    [Pg.233]    [Pg.239]    [Pg.241]    [Pg.243]    [Pg.245]   
See also in sourсe #XX -- [ Pg.302 , Pg.305 ]




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Deposition on SAM-Modified Electrodes

Electrode modifier

Metal Deposition on SAM-Modified Electrodes

Modified electrodes

SAMs

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