Ryton polyphenylene sulphide

The Ryton polyphenylene sulphide compounds are formulated for the encapsulation of semiconductors and discrete components and are particularly suited to this application because of their excellent thermal stability, resistance to chemical environments, flame retardancy and good electrical properties over a wide temperature range. In order to be suitable for the encapsulation of microcircuits and transistors the material must have good flow during moulding, good dimensional stability, low levels of impurities and low moisture absorption characteristics. 

Polyphenylene sulphide (PPS) (e.g. Ryton ) is a highly crystalline polymer with a melting point of 290 °C. It combines good mechanical properties with very high thermal and chemical resistance it is, moreover, self-extinguishing. It is, i.a., used as protective coating on metal surfaces. 

Polyphenylene- Sulphide Ryton Procon 190 G VG E Strong oxidising agents... 

Polyphenylene sulphide Ryton Phillips Petroleum 200 45 v-0.. . 5V Injection grade... 

PPS Polyphenylene sulphide Bayer GE Plastics Hoechst Phillips Solvay Tedur Supcc Fortron Ryton Primef... 

Polyphenylene sulphide (PPS) was first produced in quantities that enabled its structure to be elucidated in 1948 but it was not until 1972 that the commercial exploitation of the material was begun by the Phillips Petroleum Company who named the product Ryton . As produced, it is a thermoplastic white powder, with a molecular structure based upon the repeat unit... 

Polyphenylene sulphide has been used commercially to encapsulate ceramic capacitors for several years and mica capacitors encapsulated in Phillips Ryton BR61B have recently received the British Standard 9000 approval (BS9070-N-002). More recently, attempts have been made to encapsulate wire-bonded integrated circuits, which is one of the most difficult applications to successfully mould with a thermoplastic material because of problems with wire-bond sweep. By paying particular attention to the melt viscosity of the PPS and having careful control of the moulding parameters it has been shown that it is possible to mould successfully both TTL and linear operational amplifier type devices. 

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