Rutherford backscattering contacts

Blends of this copolymer with polystyrene were analysed by contact angle measurements and Rutherford backscattering (RBS) both of which showed that the surface was silicone rich. 

Techniques based on the interaction of ions with solids, such as secondary ion mass spectrometry (SIMS) and low-energy ion scattering (LEIS) have undoubtedly been accepted in catalyst characterization, but are by no means as widely applied as for example X-ray photoelectron spectroscopy (XPS) or X-ray diffraction (XRD). Nevertheless, SIMS, with its unsurpassed sensitivity for many elements, may yield unique information on whether or not elements on a surface are in contact with each other. LEIS is a surface technique with true outer layer sensitivity, and is highly useful for determining to what extent a support is covered by the catalytic material. Rutherford backscattering (RBS) is less suitable for studying catalysts, but is indispensable for determining concentrations in model systems, where the catalytically active material is present in monolayer (ML)-like quantities on the surface of a flat model support. 

This paper describes a process for activating polyimide surfaces for electroless metal plating. A thin surface region of a polyimide film can be electro-chemically reduced when contacted with certain reducing agent solutions. The electroactivity of polyimides is used to mediate electron transfer for depositing catalytic metal (e.g., Pd, Pt, Ni, Cu) seeds onto the polymer surface. The proposed metal deposition mechanism presented is based on results obtained from cyclic voltammetric, UV-visible, and Rutherford backscattering analysis of reduced and metallized polyimide films. This process allows blanket and full-additive metallization of polymeric materials for electronic device fabrication. 

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