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Ruthenium multilayer film

Given the high oxidation rates of silicon-terminated multilayer films, other capping layer materials have been studied extensively. Oxidation can be appreciably reduced with protective capping layers. Extended lifetimes have been reported for ruthenium (Ru)-capped and carbon-capped ML mirrors. Ruthenium... [Pg.725]

The largest uses of platinum group metals in electronics are ruthenium for resistors and palladium for multilayer capacitors, both applied by thick film techniques . Most anodes for brine electrolysis are coated with mixed ruthenium and titanium oxide by thermal decomposition . Chemical vapour deposition of ruthenium was patented for use on cutting tools . [Pg.566]

Electronic Applications. The PGMs have a number of important and diverse applications in the electronics industry (30). The most widely used are palladium and ruthenium. Palladium or palladium—silver thick-film pastes are used in multilayer ceramic capacitors and conductor inks for hybrid integrated circuits (qv). In multilayer ceramic capacitors, the termination electrodes are silver or a silver-rich Pd—Ag alloy. The internal electrodes use a palladium-rich Pd—Ag alloy. Palladium salts are increasingly used to plate edge connectors and lead frames of semiconductors (qv), as a cost-effective alternative to gold. In 1994, 45% of total ruthenium demand was for use in ruthenium oxide resistor pastes (see ELECTRICAL CONNECTORS). [Pg.173]

The application of the SPR technique to the measurement of the electro-optic coefficient is described, as an extension to the measurement of film thickness and permittivity. PreUminary results are presented of the measurement of linear optical parameters, showing that for multilayers of ruthenium (Ti -cyclopentadienyl) - (bistriphenylphosphine) - 4 - cyano - 4 -n -pentyl-p -terphenyl hexafluorophosphate (RuCTP) [1], the first monolayer is influenced by the substrate, while subsequent layers are mutually identical. [Pg.605]

Wu, A.P., Lee, J. and Rubner, M.F., Light emitting electrochemical devices from sequentially adsorbed multilayers of a polymeric ruthenium (II) complex and various polyanions. Thin Solid Films, 1998. 329 p. 663-667. [Pg.445]


See other pages where Ruthenium multilayer film is mentioned: [Pg.173]    [Pg.238]    [Pg.289]    [Pg.50]    [Pg.180]    [Pg.106]    [Pg.193]    [Pg.106]    [Pg.136]    [Pg.336]    [Pg.478]    [Pg.227]    [Pg.228]    [Pg.87]    [Pg.171]    [Pg.127]    [Pg.85]    [Pg.683]    [Pg.82]    [Pg.181]    [Pg.90]    [Pg.551]    [Pg.159]    [Pg.177]    [Pg.178]    [Pg.227]    [Pg.228]   
See also in sourсe #XX -- [ Pg.312 ]




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Multilayered film

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