Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Rigid flexible combination

Examples for the first instance are rigid-flexible combinations, e.g. a flexible seal injected onto a rigid structural component. In the second case, rearlights or computer keyboard elements come to mind. [Pg.28]

Self-Adhesive Liquid Silicone Rubbers (LSRs) for the Injection Molding of Rigid Flexible Combinations... [Pg.671]

Keywords liquid silicone rubber, injection molding, adhesion, rigid flexible combination... [Pg.671]

Generally, there are three different technologies for the manufacture of a rigid flexible combination, where an LSR represents the flexible part ... [Pg.672]

Fig. 2. Combining strategies for rigid flexible combinations from thermoplastics and LSR. Fig. 2. Combining strategies for rigid flexible combinations from thermoplastics and LSR.
Rigid/flexible combination PCBs combine the benefits of the rigid PCB with integrated flexible parts. This type of PCB requires evaluation of both the rigid and flexible sections for acceptability. [Pg.1173]

It is also common practice to classify filter media by their materials of construction. Examples are cotton, wool, linen, glass fiber, porous carbon, metals and rayons. Such a classification is convenient for selection purposes, especially when resistance to aggressive suspensions is a consideration. We may also classify media according to structure, with typical classes being rigid, flexible and semi-rigid or combination media. [Pg.20]

Base Material Voids after Thermal Stress. Heat from soldering operations wiU transfer quickly through the copper holes and pads in a PCB to the base material in close proximity to the copper. This rapid heat movement can easily cause imperfections to occur in the base material and this area near the holes is exempted from evalnation for base material imperfections. This area is defined as the thermal zone and described in detail by IPC-A-600. Outside this thermal zone, base material voids should not exceed 0.08 mm for rigid PCBs and 0.5 mm for flexible PCBs or flexible portions of rigid-flexible PCBs. Base material voids found in the same plane of flexible or rigid-flexible PCBs should not have a combined dimension greater than 0.5 mm (see Rg. 51.20). [Pg.1195]

Many choices of conductor materials are available for lamination-type adhesiveless laminates. Due to the special combination of conductor materials with stainless steel and copper alloy foils, this noaterial has a variety of uses in multilayer rigid/flexible aerospace applications and in wireless suspension of disk drives. Generally, the adhesive polyimide is difficult to etch using standard alkaline etching solutions, so strong chemistry or a physical process such as plasma etching is required for the process. [Pg.1478]

Oxide fibers are manufactured by thermal or chemical processes into a loose wool mat, which can then be fabricated into a flexible blanket combined with binders and formed into boards, felts, and rigid shapes or fabricated into ropes, textiles and papers. The excellent thermal properties of these products make them invaluable for high temperature industrial appHcations. [Pg.53]

Lubrication requirements vary depending on application and coupling type. Because rigid couplings do not require lubrication, this section discusses lubrication requirements for mechanical-flexing, material-flexing, and combination flexible couplings only. [Pg.997]


See other pages where Rigid flexible combination is mentioned: [Pg.671]    [Pg.672]    [Pg.855]    [Pg.48]    [Pg.311]    [Pg.671]    [Pg.672]    [Pg.855]    [Pg.48]    [Pg.311]    [Pg.313]    [Pg.545]    [Pg.149]    [Pg.62]    [Pg.298]    [Pg.247]    [Pg.545]    [Pg.5]    [Pg.609]    [Pg.476]    [Pg.18]    [Pg.40]    [Pg.3649]    [Pg.21]    [Pg.1493]    [Pg.464]    [Pg.260]    [Pg.121]    [Pg.313]    [Pg.2496]    [Pg.242]    [Pg.197]    [Pg.381]    [Pg.408]    [Pg.123]    [Pg.270]    [Pg.342]    [Pg.350]    [Pg.100]    [Pg.155]    [Pg.244]    [Pg.172]    [Pg.403]   
See also in sourсe #XX -- [ Pg.671 ]




SEARCH



© 2024 chempedia.info