Resist materials negative

No materials have properties that fulfill all requirements. For example, good heat conductivity is a desirable property for the fabrication of heat exchanger surfaces, but not for insulation purposes. Obviously, both positive and negative properties can coexist in a single material. A corrosion resistant material may be insufficient for heat resistance or mechanical strength. Strong materials may be too brittle, e.g., ferrosilicon. Also, materials that have good mechanical and chemical properties may be too expensive. 

This technique is used to transfer a computer-generated pattern onto a substrate. Here, a film of photoresist is spin-coated onto the substrate and exposed to UV light through a photolithographic mask the light exposure transfers the desired pattern to the photoresist. Depending on whether the resist material is positive or negative , the photoresist... 

The use of phenolic polymers in photocrosslinkable systems usually involves multicomponent systems which incorporate polyfunctional low molecular weight crosslinkers. For example, Feely et al. [9] have used hydroxymethyl melamine in combination with a photoactive diazonaphthoquinone which produces an indene carboxylic acid upon irradiation to crosslink a novolac resin. Similarly, Iwayanagi et al. [10] have used photoactive bisazides in combination with poly(p-hydroxy-sty-rene) to afford a negative-tone resist material which does not swell upon development in aqueous base. 

The photoresponsive properties of molecular glasses also have been applied in the design of resists for semiconductor lithography. In a resist, irradiation changes the solubility of the materials, making it more or less soluble (positive or negative resist, respectively). The search for new resist materials follows the development of lithographic techniques toward deep-UV and electron beam... 

Resist materials can be classified as positive or negative on the basis of their radiation response as described in Section 3.1 and illustrated in Figure 1. Both resist types can be subdivided into two categories depending upon the basic nature of their design 1) one-component systems and 2) two-component systems (see Figure 2). One-component systems are polymers that combine radiochemical reactivity with etch resistance and film-forming characteristics. In two component systems, the resist is formulated from an... 

The most familiar negative photoresists are examples of two-component, resist materials. These include Kodak s KTFR, Merck s Selectilux N, Hunt s HNR, etc., all of which consist of a cyclized synthetic rubber matrix resin which is radiation insensitive but forms excellent films. This resin is combined with a bis-arylazide sensitizer. 

C The Epoxy Resists. The first negative tone electron beam resist materials with useful sensitivity were based on utilizing the radiation chemistry of the oxirane or epoxy moiety. The most widely used of these materials, COP (Figure 32) is a copolymer of glycidyl methacrylate and ethyl acrylate and was developed at Bell Laboratories (43,44). COP has found wide applicability in the manufacturing of photomasks. The active element... 

These results confirm the potential of poly (p-formyloxystyrene) as a useful resist material combining such interesting properties as ability to be imaged in both positive or negative tone, ease of preparation, and activity in the deep UV, with a moderate sensitivity and good contrast. 

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