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Reliability testing joint selection

Table 4 Select Sn-Ag-Cu solder joint reliability test parameters and results ... Table 4 Select Sn-Ag-Cu solder joint reliability test parameters and results ...
Reliability testing—Einal stage of the alloy selection process, involving thermal cycle and extensive joint examination. [Pg.93]

Despite great strides, the problems arising from plasma-material interactions (PMIs), together with the selection of plasma facing materials, still represent major challenges for the reliable and safe operation of a D-T next-step tokamak [1]. They also remain potential obstacles for the successful development of future fusion power reactors. These issues came into sharp focus during D-T operation of the Tokamak Fusion Test Reactor (TFTR) and the Joint European Torus (JET) and, in particular, in the process of designing ITER. [Pg.288]

Because the fracture toughness depends both on cure time and temperature, the arbitrary selection of time and temperature for accelerated tests may not be appropriate for reliable prediction of longterm service life of joints (J7). In order to reduce test variability and improve the durability prediction of adhesive joints, it would be necessary first to control the cure temperature and time required to produce a level of fracture toughness that does not change further (14). The study is thus an excellent example of a multidisciplinary approach combining chemistry, fracture mechanics, and wood science in the investigation of the adhesive bonding of wood. [Pg.334]


See other pages where Reliability testing joint selection is mentioned: [Pg.226]    [Pg.215]    [Pg.1307]    [Pg.682]    [Pg.769]    [Pg.191]    [Pg.1335]    [Pg.214]    [Pg.390]    [Pg.302]    [Pg.1290]    [Pg.283]    [Pg.8]    [Pg.158]    [Pg.676]    [Pg.685]   
See also in sourсe #XX -- [ Pg.96 ]




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